M38510/65005BCA vs MC74HCT00ADR2 feature comparison

M38510/65005BCA QP Semiconductor

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MC74HCT00ADR2 Motorola Mobility LLC

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC MOTOROLA INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 151.15
CO2e (mg) 20219.441 1874.26
Family HC/UH HCT
JESD-30 Code R-GDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 29 ns 28 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 3
Pbfree Code No
Rohs Code No
Length 8.65 mm
Load Capacitance (CL) 50 pF
Package Equivalence Code SOP14,.25
Packing Method TR
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Terminal Pitch 1.27 mm
Width 3.9 mm

Compare M38510/65005BCA with alternatives

Compare MC74HCT00ADR2 with alternatives