M95M01-RMN6P
vs
AT45DB021D-MH-SL955
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP-8
|
6 X 5 MM, 0.60 MM HEIGHT, GREEN, PLASTIC, MO-229, UDFN-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Factory Lead Time |
8 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Clock Frequency-Max (fCLK) |
5 MHz
|
66 MHz
|
| Data Retention Time-Min |
40
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
4.9 mm
|
6 mm
|
| Memory Density |
1048576 bit
|
2097152 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
1
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
131072 words
|
2097152 words
|
| Number of Words Code |
128000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128KX8
|
2MX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
0.6 mm
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.000003 A
|
|
| Supply Current-Max |
0.005 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
5 mm
|
| Write Cycle Time-Max (tWC) |
5 ms
|
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
4
|
1
|
| Additional Feature |
|
ORGANIZED AS 1,024 PAGES OF 256 BYTES EACH
|
| Programming Voltage |
|
2.7 V
|
|
|
|
Compare M95M01-RMN6P with alternatives
Compare AT45DB021D-MH-SL955 with alternatives