MB84VD22387EJ-85-PBS vs K5A3340YBC-T7550 feature comparison

MB84VD22387EJ-85-PBS Spansion

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K5A3340YBC-T7550 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description TFBGA, BGA71,8X12,32 TFBGA,
Pin Count 71 69
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns
Additional Feature FCRAM IS ORGANIZED AS 1M X 16; IT ALSO REQUIRES 2.7V TO 3.1V SUPPLY FOR FCRAM SRAM IS ORGANIZED AS 512K X 8 / 256K X 16; NOR FLASH CAN ALSO BE ORGANIZED AS 4M X 8
JESD-30 Code R-PBGA-B71 R-PBGA-B69
JESD-609 Code e0
Length 11 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 71 69
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA71,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.000005 A
Supply Current-Max 0.053 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 8 mm
Base Number Matches 4 1

Compare MB84VD22387EJ-85-PBS with alternatives

Compare K5A3340YBC-T7550 with alternatives