MM74HC00NX
vs
CD74HC00EE4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ON SEMICONDUCTOR
TEXAS INSTRUMENTS INC
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
113 ns
135 ns
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
Samacsys Manufacturer
Texas Instruments
JESD-609 Code
e4
Length
19.305 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.0052 A
Package Equivalence Code
DIP14,.3
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
27 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5.08 mm
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare MM74HC00NX with alternatives
Compare CD74HC00EE4 with alternatives