MT29F8G08ABABAWP-ITX:B vs W29N08GVBJAF feature comparison

MT29F8G08ABABAWP-ITX:B Micron Technology Inc

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W29N08GVBJAF Winbond Electronics Corp

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description TSOP-48 VFBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Micron Winbond
Data Polling NO
JESD-30 Code R-PDSO-G48 R-PBGA-B63
JESD-609 Code e3
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 63
Number of Words 1073741824 words 1073741824 words
Number of Words Code 1000000000 1000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1GX8 1GX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING BALL
Terminal Position DUAL BOTTOM
Toggle Bit NO
Type SLC NAND TYPE SLC NAND TYPE
Base Number Matches 1 1
Data Retention Time-Min 10
Length 11 mm
Package Code VFBGA
Package Equivalence Code BGA63,10X12,32
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Programming Voltage 3.3 V
Seated Height-Max 1 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Terminal Pitch 0.8 mm
Width 9 mm
Write Cycle Time-Max (tWC) 0.025 ms

Compare MT29F8G08ABABAWP-ITX:B with alternatives

Compare W29N08GVBJAF with alternatives