MT29F8G08ABABAWP-ITX:B vs W29N08GVSIAA feature comparison

MT29F8G08ABABAWP-ITX:B Micron Technology Inc

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W29N08GVSIAA Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description TSOP-48 TSOP1, tsop48,.787,20
Reach Compliance Code compliant compliant
ECCN Code 3A991 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Micron Winbond
Data Polling NO NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1073741824 words 1073741824 words
Number of Words Code 1000000000 1000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1GX8 1GX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Toggle Bit NO YES
Type SLC NAND TYPE SLC NAND TYPE
Base Number Matches 1 1
Alternate Memory Width 1
Command User Interface NO
Data Retention Time-Min 10
Endurance 100000 Write/Erase Cycles
Length 18.4 mm
Number of Sectors/Size 8K
Output Characteristics 3-STATE
Package Code TSOP1
Package Equivalence Code tsop48,.787,20
Package Style SMALL OUTLINE, THIN PROFILE
Page Size 2K words
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 128K
Standby Current-Max 0.0002 A
Supply Current-Max 0.35 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm

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