MX574AKD vs HI1-574ASD-8 feature comparison

MX574AKD Maxim Integrated Products

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HI1-574ASD-8 Harris Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC HARRIS SEMICONDUCTOR
Part Package Code DIE
Package Description DIE, DIP, DIP28,.6
Pin Count 28
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog Input Voltage-Max 10 V 10 V
Analog Input Voltage-Min -10 V -10 V
Conversion Time-Max 25 µs 25 µs
Converter Type ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 Code R-XUUC-N28 R-CDIP-T28
JESD-609 Code e0 e0
Linearity Error-Max (EL) 0.0122% 0.0244%
Moisture Sensitivity Level 1
Negative Supply Voltage-Nom -15 V -12 V
Number of Analog In Channels 1 1
Number of Bits 12 12
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Bit Code BINARY, OFFSET BINARY BINARY
Output Format PARALLEL, WORD PARALLEL, 8 BITS, PARALLEL, WORD
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Qualification Status Not Qualified Not Qualified
Sample and Hold / Track and Hold SAMPLE
Seated Height-Max 5.89 mm
Supply Voltage-Nom 15 V 12 V
Surface Mount YES NO
Technology BICMOS BICMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position UPPER DUAL
Width 15.24 mm
Base Number Matches 3 2
ECCN Code 3A001.A.2.C
Package Equivalence Code DIP28,.6
Screening Level MIL-STD-883 Class B (Modified)

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Compare HI1-574ASD-8 with alternatives