NAND01GW3B2BZA1 vs S34ML01G200TFI003 feature comparison

NAND01GW3B2BZA1 Micron Technology Inc

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S34ML01G200TFI003 Spansion

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC SPANSION INC
Part Package Code BGA
Package Description TFBGA, TSOP1-48
Pin Count 63
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PBGA-B63 R-PDSO-G48
Length 12 mm 18.4 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 48
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3.3 V
Seated Height-Max 1.05 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Width 9.5 mm 12 mm
Base Number Matches 3 3
Rohs Code Yes
Access Time-Max 25 ns
Command User Interface YES
Common Flash Interface NO
Data Polling NO
Data Retention Time-Min 10
Number of Sectors/Size 1K
Package Equivalence Code TSSOP48,.8,20
Page Size 2K words
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Toggle Bit NO
Type SLC NAND TYPE
Write Cycle Time-Max (tWC) 0.000025 ms

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