STM32F401RCT6
vs
STM32F401RCT3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Package Description |
Lqfp-64
|
|
| ECCN Code |
3A991.A.2
|
3A991.a.2
|
| HTS Code |
8542.31.00.25
|
8542.31.00.25
|
| Factory Lead Time |
15 Weeks
|
|
| Has ADC |
Yes
|
Yes
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
Yes
|
|
| CPU Family |
Cortex-M4f
|
|
| Clock Frequency-Max |
26 Mhz
|
26 Mhz
|
| DAC Channels |
No
|
|
| DMA Channels |
Yes
|
Yes
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G64
|
|
| JESD-609 Code |
e3
|
|
| Length |
10 Mm
|
10 Mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
50
|
50
|
| Number of Terminals |
64
|
64
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
Yes
|
Yes
|
| Package Body Material |
Plastic/Epoxy
|
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP64,.47SQ,20
|
|
| Package Shape |
Square
|
Square
|
| Package Style |
Flatpack, Low Profile, Fine Pitch
|
Flatpack, Low Profile, Fine Pitch
|
| Packing Method |
Tray
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
65536
|
|
| ROM (words) |
262144
|
|
| ROM Programmability |
Flash
|
|
| Seated Height-Max |
1.6 Mm
|
|
| Speed |
84 Mhz
|
84 Mhz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
1.7 V
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
|
| Temperature Grade |
Industrial
|
|
| Terminal Finish |
Matte Tin (Sn) - Annealed
|
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.5 Mm
|
0.5 Mm
|
| Terminal Position |
Quad
|
Quad
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 Mm
|
10 Mm
|
| uPs/uCs/Peripheral ICs Type |
Microcontroller, Risc
|
Microcontroller, Risc
|
| Base Number Matches |
2
|
2
|
|
|
|