TS68882VF25 vs MC68881RC25 feature comparison

TS68882VF25 e2v technologies

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MC68881RC25 Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD MOTOROLA INC
Part Package Code QFP PGA
Package Description CERAMIC, QFP-68 PGA,
Pin Count 68 68
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 5 6
Boundary Scan NO NO
Clock Frequency-Max 25 MHz 25 MHz
External Data Bus Width 32 32
JESD-30 Code S-CQFP-G68 S-CPGA-P68
Length 24.13 mm 26.92 mm
Number of Terminals 68 68
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFP PGA
Package Equivalence Code QFP68,1.1SQ,50
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.43 mm 2.59 mm
Supply Current-Max 136 mA 150 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING PIN/PEG
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 24.13 mm 26.92 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, FLOATING POINT ACCELERATOR
Base Number Matches 1 1
Barrel Shifter YES
Bus Compatibility MC68020
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

Compare TS68882VF25 with alternatives

Compare MC68881RC25 with alternatives