UPD29F064115F9-EB90X-CD6 vs NAND01GW4A0AZB1E feature comparison

UPD29F064115F9-EB90X-CD6 NEC Electronics Group

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NAND01GW4A0AZB1E Numonyx Memory Solutions

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP NUMONYX
Part Package Code BGA BGA
Package Description 11 X 8 MM, TAPE, FBGA-63 9 X 11 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-63
Pin Count 63 63
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 35 ns
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e0
Length 11 mm 11 mm
Memory Density 67108864 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 4194304 words 67108864 words
Number of Words Code 4000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -25 °C
Organization 4MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.07 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE SLC NAND TYPE
Width 8 mm 9 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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