W25Q16DVSNIP vs IS25LQ016B-JKLE1 feature comparison

W25Q16DVSNIP Winbond Electronics Corp

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IS25LQ016B-JKLE1 Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Package Description SOIC-8 HVSON,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-N8
Length 4.9 mm 6 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 3 V
Seated Height-Max 1.75 mm 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 3.9 mm 5 mm
Base Number Matches 1 1
Endurance 100000 Write/Erase Cycles
JESD-609 Code e3
Package Equivalence Code SOLCC8,.25
Peak Reflow Temperature (Cel) 260
Serial Bus Type QSPI
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30
Write Protection HARDWARE/SOFTWARE

Compare W25Q16DVSNIP with alternatives

Compare IS25LQ016B-JKLE1 with alternatives