W27C512P-45Z
vs
HY27UH08AG5BTC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SK HYNIX INC
|
| Part Package Code |
QFJ
|
TSOP1
|
| Package Description |
0.330 INCH, LEAD FREE, PLASTIC, LCC-32
|
TSOP1,
|
| Pin Count |
32
|
48
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.1.B.2
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
45 ns
|
|
| JESD-30 Code |
R-PQCC-J32
|
R-PDSO-G48
|
| Length |
13.97 mm
|
18.4 mm
|
| Memory Density |
524288 bit
|
17179869184 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
48
|
| Number of Words |
65536 words
|
2147483648 words
|
| Number of Words Code |
64000
|
2000000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64KX8
|
2GX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
TSOP1
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programming Voltage |
12 V
|
3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.56 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
11.43 mm
|
12 mm
|
| Base Number Matches |
1
|
4
|
| Type |
|
SLC NAND TYPE
|
|
|
|
Compare W27C512P-45Z with alternatives
Compare HY27UH08AG5BTC with alternatives