5962-9669112HYC by: Micross Components

Standard SRAM, 128KX8, 55ns, CMOS, DIP-32

Part Details for 5962-9669112HYC by Micross Components

Overview of 5962-9669112HYC by Micross Components

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Part Details for 5962-9669112HYC

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5962-9669112HYC Part Data Attributes:

5962-9669112HYC Micross Components
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5962-9669112HYC Micross Components Standard SRAM, 128KX8, 55ns, CMOS, DIP-32
Part Life Cycle Code Active
Ihs Manufacturer MICROSS COMPONENTS
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 55 ns
I/O Type COMMON
JESD-30 Code R-XDIP-T32
JESD-609 Code e4
Length 41.91 mm
Memory Density 1048576 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.1 mm
Standby Current-Max 0.0015 A
Standby Voltage-Min 2 V
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for 5962-9669112HYC

This table gives cross-reference parts and alternative options found for 5962-9669112HYC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9669112HYC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT5C1008CW-55E/883C Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components 5962-9669112HYC vs MT5C1008CW-55E/883C
FT61023L-55CWC Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-32 Force Technologies Ltd 5962-9669112HYC vs FT61023L-55CWC
FT8128SXL-55 Standard SRAM, 128KX8, 55ns, CMOS, 0.600 INCH, DIP-32 Force Technologies Ltd 5962-9669112HYC vs FT8128SXL-55
P4C1024L-55CWILF Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, LEAD FREE, CERAMIC, DIP-32 Pyramid Semiconductor Corporation 5962-9669112HYC vs P4C1024L-55CWILF
P4C1024L-55CWCLF Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, LEAD FREE, CERAMIC, DIP-32 Pyramid Semiconductor Corporation 5962-9669112HYC vs P4C1024L-55CWCLF
P4C1024-55DWMB Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Pyramid Semiconductor Corporation 5962-9669112HYC vs P4C1024-55DWMB
FT61024L-55C6MB Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-32 Force Technologies Ltd 5962-9669112HYC vs FT61024L-55C6MB
MT5C1008CW-55E/IT Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components 5962-9669112HYC vs MT5C1008CW-55E/IT
MT5C1008CW-55LE/883C Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components 5962-9669112HYC vs MT5C1008CW-55LE/883C

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