Part Details for AM27C256-200PI by Spansion
Overview of AM27C256-200PI by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
AM27C256-55DM/B | Rochester Electronics | AM27C256 - 256K (32KX8) CMOS EPROM | |
AM27C256-120PC-G | Rochester Electronics | AM27C256 - 256Kb (32K x 8-Bit) CMOS OTP EPROM | |
AM27C256-150DI | Rochester Electronics LLC | Replacement for AMD part number AM27C256-150DI. Buy from authorized manufacturer Rochester Electronics. |
Part Details for AM27C256-200PI
AM27C256-200PI CAD Models
AM27C256-200PI Part Data Attributes
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AM27C256-200PI
Spansion
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Datasheet
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AM27C256-200PI
Spansion
OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | DIP | |
Package Description | DIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 80 ns | |
JESD-30 Code | R-PDIP-T28 | |
Length | 37.084 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64KX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.715 mm | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27C256-200PI
This table gives cross-reference parts and alternative options found for AM27C256-200PI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-200PI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
5962-8606311UA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | QP Semiconductor | AM27C256-200PI vs 5962-8606311UA |
5962-8606311UX | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | AM27C256-200PI vs 5962-8606311UX |
NM27LC256Q200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-200PI vs NM27LC256Q200 |
NM27C256NE200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | AM27C256-200PI vs NM27C256NE200 |
CY27C256-200WC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C256-200PI vs CY27C256-200WC |
NMC27C256BN200 | 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 | Texas Instruments | AM27C256-200PI vs NMC27C256BN200 |
27C256MQB/C20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | AM27C256-200PI vs 27C256MQB/C20 |
TMX27PC256-2NL | 32KX8 OTPROM, 200ns, PDIP28 | Texas Instruments | AM27C256-200PI vs TMX27PC256-2NL |
27C256MQB/C20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | AM27C256-200PI vs 27C256MQB/C20 |
QP27C256L-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | AM27C256-200PI vs QP27C256L-200/XA |