Part Details for AM27C64-300DE by AMD
Overview of AM27C64-300DE by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| RTKA215300DE0000BU | Renesas Electronics Corporation | RAA215300 Evaluation Board |
Part Details for AM27C64-300DE
AM27C64-300DE CAD Models
AM27C64-300DE Part Data Attributes
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AM27C64-300DE
AMD
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Datasheet
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AM27C64-300DE
AMD
UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| Length | 37.1475 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Standby Current-Max | 0.00012 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C64-300DE
This table gives cross-reference parts and alternative options found for AM27C64-300DE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-300DE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM2764-30-XZ | UVPROM, 8KX8, 300ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | AM27C64-300DE vs MBM2764-30-XZ |
| AM2764A-30DI | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C64-300DE vs AM2764A-30DI |
| MBM2764-30-XZ | 8KX8 UVPROM, 300ns, CDIP28, CERDIP-28 | FUJITSU Limited | AM27C64-300DE vs MBM2764-30-XZ |
| QD2764-30 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | AM27C64-300DE vs QD2764-30 |
| M27C64A-30F6X | 8KX8 UVPROM, 300ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | AM27C64-300DE vs M27C64A-30F6X |
| MBM27C64-30Z | EPROM, 8KX8, 300ns, CMOS, CDIP28, | FUJITSU Limited | AM27C64-300DE vs MBM27C64-30Z |
| MBM27C64-30Z-X | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | FUJITSU Semiconductor Limited | AM27C64-300DE vs MBM27C64-30Z-X |
| M27C64A-30F1 | 8KX8 UVPROM, 300ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C64-300DE vs M27C64A-30F1 |
| AM27C64-300DI | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-300DE vs AM27C64-300DI |
| 27C64MQ30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | AM27C64-300DE vs 27C64MQ30 |