Datasheets
AM27LS18PCB by: AMD

OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16

Part Details for AM27LS18PCB by AMD

Overview of AM27LS18PCB by AMD

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Part Details for AM27LS18PCB

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AM27LS18PCB Part Data Attributes:

AM27LS18PCB AMD
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AM27LS18PCB AMD OTP ROM, 32X8, 55ns, Bipolar, PDIP16, PLASTIC, DIP-16
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 25 ns
JESD-30 Code R-PDIP-T16
JESD-609 Code e0
Length 19.1135 mm
Memory Density 8192 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 16
Number of Words 32 words
Number of Words Code 1000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 75 °C
Operating Temperature-Min
Organization 1KX8
Output Characteristics OPEN-COLLECTOR
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for AM27LS18PCB

This table gives cross-reference parts and alternative options found for AM27LS18PCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27LS18PCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27LS19DCB OTP ROM, 32X8, 55ns, Bipolar, CDIP16, CERAMIC, DIP-16 AMD AM27LS18PCB vs AM27LS19DCB
Part Number Description Manufacturer Compare
TBP18SA030MJ 32X8 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16 Texas Instruments AM27LS18PCB vs TBP18SA030MJ
M54731AS-1 OTP ROM, 32X8, 30ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 Mitsubishi Electric AM27LS18PCB vs M54731AS-1
N82S123F OTP ROM, 32X8, 50ns, Bipolar, CDIP16, Signetics AM27LS18PCB vs N82S123F
IDM29751JM 32X8 OTPROM, 40ns, CDIP16, HERMETIC SEALED, DIP-16 Texas Instruments AM27LS18PCB vs IDM29751JM
N82S23NB OTP ROM, 32X8, 50ns, Bipolar, PDIP16, Signetics AM27LS18PCB vs N82S23NB
AM27S19APC OTP ROM, 32X8, 25ns, Bipolar, PDIP16, PLASTIC, DIP-16 AMD AM27LS18PCB vs AM27S19APC
DM74S188N OTP ROM, 32X8, 35ns, Bipolar, PDIP16 National Semiconductor Corporation AM27LS18PCB vs DM74S188N
S82S123F883B OTP ROM, 32X8, 65ns, Bipolar, CDIP16, DIP-16 Signetics AM27LS18PCB vs S82S123F883B
S82S123F883C 32X8 OTPROM, 65ns, CDIP16, DIP-16 Philips Semiconductors AM27LS18PCB vs S82S123F883C
N82S123B OTP ROM, 32X8, 50ns, Bipolar, PDIP16, Signetics AM27LS18PCB vs N82S123B

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