Part Details for TBP18SA030MJ by Texas Instruments
Overview of TBP18SA030MJ by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for TBP18SA030MJ
TBP18SA030MJ CAD Models
TBP18SA030MJ Part Data Attributes
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TBP18SA030MJ
Texas Instruments
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Datasheet
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TBP18SA030MJ
Texas Instruments
32X8 OTPROM, 50ns, CDIP16, CERAMIC, DIP-16
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP16,.3 | |
Pin Count | 16 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 50 ns | |
JESD-30 Code | R-GDIP-T16 | |
Length | 19.56 mm | |
Memory Density | 256 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Number of Words | 32 words | |
Number of Words Code | 32 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32X8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 0.11 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7.62 mm |
Alternate Parts for TBP18SA030MJ
This table gives cross-reference parts and alternative options found for TBP18SA030MJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TBP18SA030MJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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N82S23NB | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, | Signetics | TBP18SA030MJ vs N82S23NB |
N82S23B | IC 32 X 8 OTPROM, 50 ns, PDIP16, Programmable ROM | NXP Semiconductors | TBP18SA030MJ vs N82S23B |
82S123/BEA | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, | YAGEO Corporation | TBP18SA030MJ vs 82S123/BEA |
N82S123N | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, | YAGEO Corporation | TBP18SA030MJ vs N82S123N |
AM27S18/BEA | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | TBP18SA030MJ vs AM27S18/BEA |
N82S123B | 32X8 OTPROM, 50ns, PDIP16 | Philips Semiconductors | TBP18SA030MJ vs N82S123B |
5962-8670301EX | OTP ROM, 32X8, 50ns, Bipolar, CDIP16, CERAMIC, DIP-16 | Lansdale Semiconductor Inc | TBP18SA030MJ vs 5962-8670301EX |
N82S23B | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, | Signetics | TBP18SA030MJ vs N82S23B |
M54731AP | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, PLASTIC, DIP-16 | Mitsubishi Electric | TBP18SA030MJ vs M54731AP |
N82S123N | OTP ROM, 32X8, 50ns, Bipolar, PDIP16, | Signetics | TBP18SA030MJ vs N82S123N |