Datasheets
K4S643232H-UC600 by: Samsung Semiconductor

Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH X 0.875 INCH, 0.50 MM PITCH, ROHS COMPLIANT, TSOP2-86

Part Details for K4S643232H-UC600 by Samsung Semiconductor

Overview of K4S643232H-UC600 by Samsung Semiconductor

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Computing and Data Storage Renewable Energy Robotics and Drones

Part Details for K4S643232H-UC600

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K4S643232H-UC600 Part Data Attributes

K4S643232H-UC600 Samsung Semiconductor
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K4S643232H-UC600 Samsung Semiconductor Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH X 0.875 INCH, 0.50 MM PITCH, ROHS COMPLIANT, TSOP2-86
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2
Package Description TSSOP, TSSOP86,.46,20
Pin Count 86
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.5 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 1,2,4,8
JESD-30 Code R-PDSO-G86
JESD-609 Code e6
Length 22.22 mm
Memory Density 67108864 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 32
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 1
Number of Terminals 86
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX32
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP86,.46,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 4096
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.002 A
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Bismuth (Sn/Bi)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 10.16 mm

Alternate Parts for K4S643232H-UC600

This table gives cross-reference parts and alternative options found for K4S643232H-UC600. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4S643232H-UC600, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS42S32200E-6TL Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232H-UC600 vs IS42S32200E-6TL
IS42S32200E-6TL-TR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232H-UC600 vs IS42S32200E-6TL-TR
HY57V643220CT-6 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.5 MM PITCH, TSOP2-86 SK Hynix Inc K4S643232H-UC600 vs HY57V643220CT-6
K4S643232F-TC60 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232H-UC600 vs K4S643232F-TC60
HY57V643220DTP-6 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, LEAD FREE, TSOP2-86 SK Hynix Inc K4S643232H-UC600 vs HY57V643220DTP-6
HY57V643220CT-6I Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, TSOP2-86 SK Hynix Inc K4S643232H-UC600 vs HY57V643220CT-6I
K4S643232H-UC60T Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH X 0.875 INCH, 0.50 MM PITCH, ROHS COMPLIANT, TSOP2-86 Samsung Semiconductor K4S643232H-UC600 vs K4S643232H-UC60T
IS42S32200-6TL Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232H-UC600 vs IS42S32200-6TL
Part Number Description Manufacturer Compare
IS42S32200E-6TL Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232H-UC600 vs IS42S32200E-6TL
MT48LC2M32B2P-7AT:G Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-86 Micron Technology Inc K4S643232H-UC600 vs MT48LC2M32B2P-7AT:G
K4S643232H-TL700 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, TSOP2-86 Samsung Semiconductor K4S643232H-UC600 vs K4S643232H-TL700
IS45S32200E-7TLA1 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232H-UC600 vs IS45S32200E-7TLA1
IS42S32200E-6TL-TR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, TSOP2-86 Integrated Silicon Solution Inc K4S643232H-UC600 vs IS42S32200E-6TL-TR
K4S643232C-TC700 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232H-UC600 vs K4S643232C-TC700
MT48LC2M32B2P-7:GTR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-86 Micron Technology Inc K4S643232H-UC600 vs MT48LC2M32B2P-7:GTR
K4S643232H-UL700 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH X 0.875 INCH, 0.50 MM PITCH, ROHS COMPLIANT, TSOP2-86 Samsung Semiconductor K4S643232H-UC600 vs K4S643232H-UL700
IS42S32200C1-7TL-TR Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-86 Integrated Silicon Solution Inc K4S643232H-UC600 vs IS42S32200C1-7TL-TR
K4S643232F-TC60 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 Samsung Semiconductor K4S643232H-UC600 vs K4S643232F-TC60

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