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LPC2364FBD100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC QFP 100-Pin
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
568-3995-ND
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DigiKey | IC MCU 16/32B 128KB FLSH 100LQFP Lead time: 13 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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Future Electronics | LPC23xx Series 128 kB Flash 34 kB RAM 72 MHz 16/32-Bit Microcontroller -LQFP-100 RoHS: Compliant pbFree: Yes Min Qty: 180 Package Multiple: 90 Lead time: 13 Weeks Container: Tray | 0Tray |
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$8.1200 / $8.5200 | Buy Now |
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Quest Components | 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP100 | 16 |
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$13.6350 / $15.3394 | Buy Now |
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LPC2364FBD100,551
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC2364FBD100,551
NXP Semiconductors
LPC2364FBD100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC QFP 100-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFP | |
Package Description | 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100 | |
Pin Count | 100 | |
Manufacturer Package Code | SOT407-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | ARM7 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PQFP-G100 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 70 | |
Number of Terminals | 100 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP100,.63SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 34816 | |
ROM (words) | 131072 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.6 mm | |
Speed | 72 MHz | |
Supply Current-Max | 100 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
This table gives cross-reference parts and alternative options found for LPC2364FBD100,551. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC2364FBD100,551, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
LPC2364HBD100,551 | LPC2364HBD100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC QFP 100-Pin | NXP Semiconductors | LPC2364FBD100,551 vs LPC2364HBD100,551 |
LPC2364HBD100 | IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100, Microcontroller | NXP Semiconductors | LPC2364FBD100,551 vs LPC2364HBD100 |