There are no models available for this part yet.
Overview of WE512K8200CM by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for WE512K8200CM by Microsemi Corporation
Part Data Attributes for WE512K8200CM by Microsemi Corporation
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
MICROSEMI CORP
|
|
Part Package Code
|
DIP
|
|
Package Description
|
HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
200 ns
|
|
JESD-30 Code
|
R-CDIP-T32
|
|
JESD-609 Code
|
e4
|
|
Length
|
42.8 mm
|
|
Memory Density
|
4194304 bit
|
|
Memory IC Type
|
EEPROM MODULE
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
524288 words
|
|
Number of Words Code
|
512000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
512KX8
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
DIP
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
5 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.13 mm
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
GOLD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
15.25 mm
|
|
Write Cycle Time-Max (tWC)
|
10 ms
|
Alternate Parts for WE512K8200CM
This table gives cross-reference parts and alternative options found for WE512K8200CM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WE512K8200CM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-9309104HXX | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | White Microelectronics | WE512K8200CM vs 5962-9309104HXX |
| WE512K8200CI | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | WE512K8200CM vs WE512K8200CI |
| WE512K8200CQA | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE512K8200CM vs WE512K8200CQA |
| AT28C040-20BI | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Atmel Corporation | WE512K8200CM vs AT28C040-20BI |
| WE512K8-200CM | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DIP-32 | Mercury Systems Inc | WE512K8200CM vs WE512K8-200CM |
| WE512K8-200CI | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DIP-32 | Mercury Systems Inc | WE512K8200CM vs WE512K8-200CI |
| 5962-9309104HYA | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, DIP-32 | Micross Components | WE512K8200CM vs 5962-9309104HYA |
| XM28C040MHR-20 | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 | Xicor Inc | WE512K8200CM vs XM28C040MHR-20 |
| FTE512S8N-20I | EEPROM, 512KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Force Technologies Ltd | WE512K8200CM vs FTE512S8N-20I |
| WE512K8200CC | EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WE512K8200CM vs WE512K8200CC |