Part Details for X76F200WIG-2 by IC Microsystems Sdn Bhd
Overview of X76F200WIG-2 by IC Microsystems Sdn Bhd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Telecommunications
Part Details for X76F200WIG-2
X76F200WIG-2 CAD Models
X76F200WIG-2 Part Data Attributes
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X76F200WIG-2
IC Microsystems Sdn Bhd
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Datasheet
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Compare Parts:
X76F200WIG-2
IC Microsystems Sdn Bhd
Flash, 256X8, ROHS COMPLIANT, WAFER
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | IC MICROSYSTEMS SDN BHD | |
Part Package Code | WAFER | |
Package Description | DIE, | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 1 MHz | |
JESD-30 Code | X-XUUC-N | |
Memory Density | 2048 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256X8 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIE | |
Package Shape | UNSPECIFIED | |
Package Style | UNCASED CHIP | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 2.2 V | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Type | NOR TYPE | |
Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for X76F200WIG-2
This table gives cross-reference parts and alternative options found for X76F200WIG-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X76F200WIG-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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X76F200HI-2 | Flash, 256X8, DIE | Xicor Inc | X76F200WIG-2 vs X76F200HI-2 |
X76F200H-2 | Flash, 256X8, DIE | Xicor Inc | X76F200WIG-2 vs X76F200H-2 |
X76F200WI-2 | Flash, 256X8, WAFER | Xicor Inc | X76F200WIG-2 vs X76F200WI-2 |
X76F200WG-2 | Flash, 256X8, ROHS COMPLIANT, WAFER | IC Microsystems Sdn Bhd | X76F200WIG-2 vs X76F200WG-2 |
X76F200HIG-2 | Flash, 256X8, ROHS COMPLIANT, DIE | IC Microsystems Sdn Bhd | X76F200WIG-2 vs X76F200HIG-2 |
X76F200WI-2 | Flash, 256X8, WAFER | IC Microsystems Sdn Bhd | X76F200WIG-2 vs X76F200WI-2 |
X76F200W-2 | Flash, 256X8, WAFER | IC Microsystems Sdn Bhd | X76F200WIG-2 vs X76F200W-2 |