Part Details for XPC860TCZP50D3 by Motorola Mobility LLC
Overview of XPC860TCZP50D3 by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XPC860TCZP50D3
XPC860TCZP50D3 CAD Models
XPC860TCZP50D3 Part Data Attributes
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XPC860TCZP50D3
Motorola Mobility LLC
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Datasheet
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XPC860TCZP50D3
Motorola Mobility LLC
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MOTOROLA INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC860TCZP50D3
This table gives cross-reference parts and alternative options found for XPC860TCZP50D3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860TCZP50D3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC860MHVZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TCZP50D3 vs TSPC860MHVZPU50B |
| MPC860DEZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TCZP50D3 vs MPC860DEZQ50D4 |
| MPC860DPZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860TCZP50D3 vs MPC860DPZQ50D4 |
| TSPC860SRVZP50D | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TCZP50D3 vs TSPC860SRVZP50D |
| MPC860DPVR50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TCZP50D3 vs MPC860DPVR50D4 |
| MPC860PCZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | XPC860TCZP50D3 vs MPC860PCZQ50D4 |
| XPC862TCZP50 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | XPC860TCZP50D3 vs XPC862TCZP50 |
| TSXPC860SRVZPU50D4 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860TCZP50D3 vs TSXPC860SRVZPU50D4 |
| MPC855TCVR50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860TCZP50D3 vs MPC855TCVR50D4 |
| XPC860DTZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Freescale Semiconductor | XPC860TCZP50D3 vs XPC860DTZP50D3 |