Part Details for BR100/03LLD by NXP Semiconductors
Overview of BR100/03LLD by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for BR100/03LLD
BR100/03LLD CAD Models
BR100/03LLD Part Data Attributes:
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BR100/03LLD
NXP Semiconductors
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Datasheet
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BR100/03LLD
NXP Semiconductors
DIAC, 36 V, DIAC, GLASS PACKAGE-2
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | GLASS PACKAGE-2 | |
| Pin Count | 2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.30.00.80 | |
| Breakover Voltage-Max | 36 V | |
| Breakover Voltage-Min | 28 V | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| JESD-30 Code | O-LELF-R2 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 100 °C | |
| Package Body Material | GLASS | |
| Package Shape | ROUND | |
| Package Style | LONG FORM | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Form | WRAP AROUND | |
| Terminal Position | END | |
| Trigger Device Type | DIAC |
Alternate Parts for BR100/03LLD
This table gives cross-reference parts and alternative options found for BR100/03LLD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BR100/03LLD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DB3RI | DIAC, 36V V(BO) Max, DO-35, ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2 | Taiwan Semiconductor | BR100/03LLD vs DB3RI |
| FD0200YM00TR | DIAC, 36V V(BO) Max, MINIMELF-2 | Fagor Electrónica | BR100/03LLD vs FD0200YM00TR |
| D-30B | DIAC, 36V V(BO) Max, DO-41 | Hutson Industries | BR100/03LLD vs D-30B |
| BR100/03 | DIAC, 36 V, DIAC, DO-35 | NXP Semiconductors | BR100/03LLD vs BR100/03 |
| BTD032 | DIAC, 36V V(BO) Max | Semitronics Corp | BR100/03LLD vs BTD032 |
| TCLLDB3 | DIAC, 36V V(BO) Max, DO-213AC, ROHS COMPLIANT, HERMETIC SEALED, GLASS, LL-34, MINIMELF-2 | Tak Cheong Electronics (Holdings) Co Ltd | BR100/03LLD vs TCLLDB3 |
| FV-1043/DB3.TR | DIAC, 36V V(BO) Max, DO-35, HERMETIC SEALED, GLASS PACKAGE-2 | Tak Cheong Electronics (Holdings) Co Ltd | BR100/03LLD vs FV-1043/DB3.TR |
| FV-1043/DB3 | DIAC, 36V V(BO) Max, DO-35, HERMETIC SEALED, GLASS PACKAGE-2 | Tak Cheong Electronics (Holdings) Co Ltd | BR100/03LLD vs FV-1043/DB3 |
| CT-32BK | DIAC, 36V V(BO) Max, DO-35 | Central Semiconductor Corp | BR100/03LLD vs CT-32BK |
| ST2 | DIAC, 36V V(BO) Max | Semitronics Corp | BR100/03LLD vs ST2 |