Memory
CY93L422DMB
Cypress Semiconductor
Description: Standard SRAM, 256X4, 75ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22

Overview of CY93L422DMB by Cypress Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Internet of Things (IoT) Financial Technology (Fintech) Telecommunications Communication and Networking

Price & Stock for CY93L422DMB by Cypress Semiconductor

Part # Manufacturer Description Stock Price Buy
Quest Components STANDARD SRAM, 256X4, 75NS, CMOS, CDIP22 172
  • 1 $26.0000
  • 41 $24.0000
  • 84 $23.0000
$23.0000 / $26.0000 Buy Now
Quest Components STANDARD SRAM, 256X4, 75NS, CMOS, CDIP22 9
  • 1 $40.0000
  • 7 $38.0000
$38.0000 / $40.0000 Buy Now
Quest Components STANDARD SRAM, 256X4, 75NS, CMOS, CDIP22 1
  • 1 $51.8576
$51.8576 Buy Now

CAD Models for CY93L422DMB by Cypress Semiconductor
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Part Data Attributes for CY93L422DMB by Cypress Semiconductor

CY93L422DMB
Cypress Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP22,.4
Pin Count
22
Reach Compliance Code
not_compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
75 ns
JESD-30 Code
R-GDIP-T22
JESD-609 Code
e0
Length
27.432 mm
Memory Density
1024 bit
Memory IC Type
STANDARD SRAM
Memory Width
4
Number of Functions
1
Number of Ports
1
Number of Terminals
22
Number of Words
256 words
Number of Words Code
256
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
256X4
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP22,.4
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Standby Current-Max
0.09 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
10.16 mm
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  1. CY93L422DMB
    Cypress Semiconductor
    Standard SRAM, 256X4, 75ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22
    VS

Alternate Parts for CY93L422DMB

This table gives cross-reference parts and alternative options found for CY93L422DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY93L422DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
93L422DM Cache SRAM, 256X4, 75ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Fairchild Semiconductor Corporation CY93L422DMB vs 93L422DM
M38510/23112BWA Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 Motorola Semiconductor Products CY93L422DMB vs M38510/23112BWA
M38510/23112BWX Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff CY93L422DMB vs M38510/23112BWX
93L422/BWAJC 256X4 STANDARD SRAM, 75ns, CDIP22, 736-05 Motorola Mobility LLC CY93L422DMB vs 93L422/BWAJC
M38510/23112BWA 256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22 Motorola Mobility LLC CY93L422DMB vs M38510/23112BWA
M38510/23112BWX 256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22 STMicroelectronics CY93L422DMB vs M38510/23112BWX
M38510/23112BWX Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 Harris Semiconductor CY93L422DMB vs M38510/23112BWX
5962-3823112BWX 256 X 4 STANDARD SRAM, 75 ns, DIP22, 0.375 X 0.875 INCH, DIP-22 Motorola Mobility LLC CY93L422DMB vs 5962-3823112BWX
M38510/23112BWX 256X4 STANDARD SRAM, 75ns, DIP22, 0.375 X 0.875 INCH, DIP-22 Motorola Mobility LLC CY93L422DMB vs M38510/23112BWX
M38510/23112BWA Standard SRAM, 256X4, 75ns, TTL, 0.375 X 0.875 INCH, DIP-22 SRI International Sarnoff CY93L422DMB vs M38510/23112BWA
Part Number Description Manufacturer Compare
P4C422-20CC Standard SRAM, 256X4, 20ns, CMOS, CDIP22, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-22 Pyramid Semiconductor Corporation CY93L422DMB vs P4C422-20CC
CY7C122-15DC Standard SRAM, 256X4, 15ns, CMOS, CDIP22, 0.400 INCH, CERDIP-22 Cypress Semiconductor CY93L422DMB vs CY7C122-15DC
P4C422-25DC Standard SRAM, 256X4, 25ns, CMOS, CDIP22, 0.400 INCH, CERAMIC, DIP-22 Pyramid Semiconductor Corporation CY93L422DMB vs P4C422-25DC
P4C422-15DM Standard SRAM, 256X4, 15ns, CMOS, CDIP22, 0.400 INCH, CERAMIC, DIP-22 Pyramid Semiconductor Corporation CY93L422DMB vs P4C422-15DM
MAL5101CS Standard SRAM, 256X4, 130ns, CMOS, CDIP22, Plessey Semiconductors Ltd CY93L422DMB vs MAL5101CS
AM93422APCB Standard SRAM, 256X4, 35ns, TTL, PDIP22, PLASTIC, DIP-22 AMD CY93L422DMB vs AM93422APCB
HM1-6551-9 256X4 STANDARD SRAM, 300ns, CDIP22 Intersil Corporation CY93L422DMB vs HM1-6551-9
P4C422-20PM Standard SRAM, 256X4, 20ns, CMOS, PDIP22, 0.400 INCH, PLASTIC, DIP-22 Pyramid Semiconductor Corporation CY93L422DMB vs P4C422-20PM
AM93412A/DMC Standard SRAM, 256X4, 45ns, TTL, CDIP22, HERMETIC SEALED, CERAMIC, DIP-22 AMD CY93L422DMB vs AM93412A/DMC
P4C422-25DM Standard SRAM, 256X4, 25ns, CMOS, CDIP22, 0.400 INCH, CERAMIC, DIP-22 Pyramid Semiconductor Corporation CY93L422DMB vs P4C422-25DM

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