Datasheets
H55S5162DFR-60M by: SK Hynix Inc

Synchronous DRAM, 32MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 1 MM HEIGHT, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-54

Part Details for H55S5162DFR-60M by SK Hynix Inc

Overview of H55S5162DFR-60M by SK Hynix Inc

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Part Details for H55S5162DFR-60M

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H55S5162DFR-60M Part Data Attributes:

H55S5162DFR-60M SK Hynix Inc
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H55S5162DFR-60M SK Hynix Inc Synchronous DRAM, 32MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 1 MM HEIGHT, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, FBGA-54
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description VFBGA, BGA54,9X9,32
Pin Count 54
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.4 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 1,2,4,8
JESD-30 Code S-PBGA-B54
JESD-609 Code e1
Length 10 mm
Memory Density 536870912 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 54
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
Organization 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA54,9X9,32
Package Shape SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1 mm
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.00001 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 8 mm

Alternate Parts for H55S5162DFR-60M

This table gives cross-reference parts and alternative options found for H55S5162DFR-60M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H55S5162DFR-60M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS42R16320D-6BLI Synchronous DRAM, 32MX16, 5.4ns, CMOS, PBGA54, 8 X 13 MM, 0.80 MMM, PITCH, LEAD FREE, MO-207, TFBGA-54 Integrated Silicon Solution Inc H55S5162DFR-60M vs IS42R16320D-6BLI
K4M511633C-RF1H0 Synchronous DRAM, 32MX16, 7ns, CMOS, PBGA54, FBGA-54 Samsung Semiconductor H55S5162DFR-60M vs K4M511633C-RF1H0
W989D6CBGX7E DDR DRAM, 32MX16, 5.4ns, CMOS, PBGA54, 8 X 9 MM, 0.80 MM PITCH, HALOGEN AND LEAD FREE, VFBGA-54 Winbond Electronics Corp H55S5162DFR-60M vs W989D6CBGX7E
K4M51163PC-RF1L0 Synchronous DRAM, 32MX16, 7ns, CMOS, PBGA54, FBGA-54 Samsung Semiconductor H55S5162DFR-60M vs K4M51163PC-RF1L0
K4S511533F-YL1H0 Synchronous DRAM, 32MX16, 7ns, CMOS, PBGA54, FBGA-54 Samsung Semiconductor H55S5162DFR-60M vs K4S511533F-YL1H0
MT48H32M16LFBN-75IT Synchronous DRAM, 32MX16, 5.4ns, CMOS, PBGA54, 10 X 12.50 MM, VFBGA-54 Micron Technology Inc H55S5162DFR-60M vs MT48H32M16LFBN-75IT
K4M511633C-RG1L0 Synchronous DRAM, 32MX16, 7ns, CMOS, PBGA54, FBGA-54 Samsung Semiconductor H55S5162DFR-60M vs K4M511633C-RG1L0
MT48H32M16LGBF-75:B 32MX16 SYNCHRONOUS DRAM, 5.4ns, PBGA54, 8 X 9 MM, GREEN, VFBGA-54 Micron Technology Inc H55S5162DFR-60M vs MT48H32M16LGBF-75:B
K4M51163LE-PF1L0 Synchronous DRAM, 32MX16, 7ns, CMOS, PBGA54, 0.80 MM PITCH, LEAD FREE, FBGA-54 Samsung Semiconductor H55S5162DFR-60M vs K4M51163LE-PF1L0
K4S51153PF-YF1L0 Synchronous DRAM, 32MX16, 7ns, CMOS, PBGA54, FBGA-54 Samsung Semiconductor H55S5162DFR-60M vs K4S51153PF-YF1L0

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