Datasheets
M2732AF1 by:

4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24

Part Details for M2732AF1 by STMicroelectronics

Overview of M2732AF1 by STMicroelectronics

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Applications Consumer Electronics Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

Price & Stock for M2732AF1

Part # Distributor Description Stock Price Buy
Bristol Electronics   8
RFQ
Chip1Cloud NMOS 32K 4K x 8 UV EPROM 1500
RFQ
Component Electronics, Inc IN STOCK SHIP TODAY 6
  • 1 $9.2300
  • 100 $6.9200
  • 1,000 $6.0000
$6.0000 / $9.2300 Buy Now

Part Details for M2732AF1

M2732AF1 CAD Models

M2732AF1 Part Data Attributes:

M2732AF1 STMicroelectronics
Buy Now Datasheet
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M2732AF1 STMicroelectronics 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Samacsys Manufacturer STMicroelectronics
Access Time-Max 250 ns
Additional Feature 21V PROGRAMMING VOLTAGE
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.75 mm
Memory Density 32768 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 21 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M2732AF1

This table gives cross-reference parts and alternative options found for M2732AF1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2732AF1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M2732AF6 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 STMicroelectronics M2732AF1 vs M2732AF6
NMC27C32BQ250 IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation M2732AF1 vs NMC27C32BQ250
LD2732A UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation M2732AF1 vs LD2732A
NMC27C32BQE250 IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation M2732AF1 vs NMC27C32BQE250
TMS2732A-25JP4 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments M2732AF1 vs TMS2732A-25JP4
TMS2732A-25JL 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments M2732AF1 vs TMS2732A-25JL
AM2732BDI UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2732AF1 vs AM2732BDI
AM2732B-250DI UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2732AF1 vs AM2732B-250DI
QD2732A-25 UVPROM, 4KX8, 250ns, NMOS, CDIP24, CERDIP-24 Intel Corporation M2732AF1 vs QD2732A-25
AM2732BDC UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2732AF1 vs AM2732BDC
Part Number Description Manufacturer Compare
WS57C43C-55T 4KX8 UVPROM, 55ns, CDIP24, 0.300 INCH, CERDIP-24 STMicroelectronics M2732AF1 vs WS57C43C-55T
S6333C-C MASK ROM, 4KX8, 120ns, CMOS, CDIP24 Gould Ami M2732AF1 vs S6333C-C
AM2732B-250DI UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2732AF1 vs AM2732B-250DI
AM27C43-35DM UVPROM, 4KX8, 35ns, CMOS, CDIP24, 0.300 INCH, SLIM, DIP-24 AMD M2732AF1 vs AM27C43-35DM
F353335S MASK ROM, 4KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation M2732AF1 vs F353335S
8001203JX UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 Intel Corporation M2732AF1 vs 8001203JX
LD2732A UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 Intel Corporation M2732AF1 vs LD2732A
AM2732B-200/BJA UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2732AF1 vs AM2732B-200/BJA
F353235P MASK ROM, 4KX8, 350ns, NMOS, PDIP24, PLASTIC, DIP-24 Fairchild Semiconductor Corporation M2732AF1 vs F353235P
H1837CD MASK ROM, 4KX8, 1375ns, CMOS, CDIP24 Hughes Aircraft M2732AF1 vs H1837CD

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