Part Details for AM2732BDI by AMD
Overview of AM2732BDI by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Part Details for AM2732BDI
AM2732BDI CAD Models
AM2732BDI Part Data Attributes:
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AM2732BDI
AMD
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Datasheet
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AM2732BDI
AMD
UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | WDIP, DIP24,.6 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 32.0675 mm | |
Memory Density | 32768 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM2732BDI
This table gives cross-reference parts and alternative options found for AM2732BDI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2732BDI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
NMC27C32BQ250 | IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | Texas Instruments | AM2732BDI vs NMC27C32BQ250 |
HN482732AG-25 | 4KX8 UVPROM, 250ns, PDIP24, DIP-24 | Renesas Electronics Corporation | AM2732BDI vs HN482732AG-25 |
AM2732BDC | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2732BDI vs AM2732BDC |
QD2732A-25 | UVPROM, 4KX8, 250ns, NMOS, CDIP24, CERDIP-24 | Intel Corporation | AM2732BDI vs QD2732A-25 |
M2732AF1 | 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | AM2732BDI vs M2732AF1 |
TD2732A-2 | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | AM2732BDI vs TD2732A-2 |
NMC27C32BQE250 | IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | AM2732BDI vs NMC27C32BQE250 |
LD2732A-20 | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | AM2732BDI vs LD2732A-20 |
QD2732A | UVPROM, 4KX8, 250ns, NMOS, CDIP24, CERDIP-24 | Intel Corporation | AM2732BDI vs QD2732A |
TMS2732A-25JL | 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | Texas Instruments | AM2732BDI vs TMS2732A-25JL |