Part Details for TC55V16176FF-133 by Toshiba America Electronic Components
Overview of TC55V16176FF-133 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Part Details for TC55V16176FF-133
TC55V16176FF-133 CAD Models
TC55V16176FF-133 Part Data Attributes:
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TC55V16176FF-133
Toshiba America Electronic Components
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Datasheet
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TC55V16176FF-133
Toshiba America Electronic Components
IC 1M X 18 CACHE SRAM, 4.2 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | LQFP, QFP100,.63X.87 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 4.2 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Length | 20 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | QFP100,.63X.87 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.38 mA | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |
Alternate Parts for TC55V16176FF-133
This table gives cross-reference parts and alternative options found for TC55V16176FF-133. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55V16176FF-133, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K7I161884B-FC16 | DDR SRAM, 1MX18, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | TC55V16176FF-133 vs K7I161884B-FC16 |
| AS7C33128NTD36A-200BC | ZBT SRAM, 128KX36, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | Alliance Semiconductor Corporation | TC55V16176FF-133 vs AS7C33128NTD36A-200BC |
| CY7C1345B-50AC | Cache SRAM, 128KX36, 11ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cypress Semiconductor | TC55V16176FF-133 vs CY7C1345B-50AC |
| CXK77N36R160GB-3 | Late-Write SRAM, 512KX36, 1.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 | Sony Semiconductor | TC55V16176FF-133 vs CXK77N36R160GB-3 |
| HM6AEB18202BPL50 | 2MX18 DDR SRAM, 0.45ns, PBGA165, 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165 | Renesas Electronics Corporation | TC55V16176FF-133 vs HM6AEB18202BPL50 |
| 71V3576YS150BGGI | Cache SRAM, 128KX36, 3.8ns, CMOS, PBGA119, ROHS COMPLIANT, BGA-119 | Integrated Device Technology Inc | TC55V16176FF-133 vs 71V3576YS150BGGI |
| IS61QDPB21M18A-300B4 | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | TC55V16176FF-133 vs IS61QDPB21M18A-300B4 |
| K7Q163682A-FC13 | QDR SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | Samsung Semiconductor | TC55V16176FF-133 vs K7Q163682A-FC13 |
| CY7C1386FV25-250BGI | Cache SRAM, 512KX36, 2.6ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119 | Cypress Semiconductor | TC55V16176FF-133 vs CY7C1386FV25-250BGI |
| CY7C1383AV25-100AC | Standard SRAM, 1MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cypress Semiconductor | TC55V16176FF-133 vs CY7C1383AV25-100AC |