Part Details for W27C512P-45Z by Winbond Electronics Corp
Overview of W27C512P-45Z by Winbond Electronics Corp
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Industrial Automation
Part Details for W27C512P-45Z
W27C512P-45Z CAD Models
W27C512P-45Z Part Data Attributes
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W27C512P-45Z
Winbond Electronics Corp
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Datasheet
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W27C512P-45Z
Winbond Electronics Corp
EEPROM, 64KX8, 45ns, Parallel, CMOS, PQCC32, 0.330 INCH, LEAD FREE, PLASTIC, LCC-32
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | QFJ | |
| Package Description | 0.330 INCH, LEAD FREE, PLASTIC, LCC-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.B.2 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 45 ns | |
| JESD-30 Code | R-PQCC-J32 | |
| Length | 13.97 mm | |
| Memory Density | 524288 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programming Voltage | 12 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.56 mm | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 11.43 mm |
Alternate Parts for W27C512P-45Z
This table gives cross-reference parts and alternative options found for W27C512P-45Z. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W27C512P-45Z, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MX27C4100MC-90 | OTP ROM, 512KX8, 90ns, CMOS, PDSO40, PLASTIC, SOP-40 | Macronix International Co Ltd | W27C512P-45Z vs MX27C4100MC-90 |
| CY27C64-150JC | OTP ROM, 8KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | W27C512P-45Z vs CY27C64-150JC |
| HY27UH08AG5BTC | Flash, 2GX8, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | SK Hynix Inc | W27C512P-45Z vs HY27UH08AG5BTC |
| MX23C2000PC-70 | MASK ROM, 256KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | W27C512P-45Z vs MX23C2000PC-70 |
| AM27C64-200DEB | UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | W27C512P-45Z vs AM27C64-200DEB |
| CAT28C64BPI-90 | 8KX8 EEPROM 5V, 90ns, PDIP28, PLASTIC, DIP-28 | onsemi | W27C512P-45Z vs CAT28C64BPI-90 |
| M27V512-200F6 | 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | W27C512P-45Z vs M27V512-200F6 |
| AM28F010-150FEB | Flash, 128KX8, 150ns, PDSO32, REVERSE, TSOP-32 | Rochester Electronics LLC | W27C512P-45Z vs AM28F010-150FEB |
| W27C020PM-12 | EEPROM, 256KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | Winbond Electronics Corp | W27C512P-45Z vs W27C020PM-12 |
| AT27LV512A-55JU | OTP ROM, 64KX8, 55ns, CMOS, PQCC32, GREEN, PLASTIC, MS-016AE, LCC-32 | Atmel Corporation | W27C512P-45Z vs AT27LV512A-55JU |