Parametric results for: HY57V under DRAMs

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IS49NLS96400A-33WBL
Integrated Silicon Solution Inc
$1.0000 Yes Active 603.9798 Mbit 9 64MX9 1.8 V MULTI BANK PAGE BURST DDR DRAM AUTO REFRESH 1 1 64000000 67.1089 M SYNCHRONOUS 1.9 V 1.7 V CMOS OTHER R-PBGA-B144 95 °C NOT SPECIFIED NOT SPECIFIED 144 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES BALL 1 mm BOTTOM 1.2 mm 18.5 mm 11 mm INTEGRATED SILICON SOLUTION INC TBGA, compliant EAR99 8542.32.00.32 Integrated Silicon Solution Inc.
MTA9ADF1G72PZ-3G2E1
Micron Technology Inc
$1.0000 Obsolete 77.3094 Gbit 72 1GX72 1.2 V SINGLE BANK PAGE BURST DDR DRAM MODULE AUTO/SELF REFRESH; WD-MAX 1 1 1000000000 1.0737 G SYNCHRONOUS YES 1.26 V 1.14 V CMOS OTHER R-XDMA-N288 95 °C NOT SPECIFIED NOT SPECIFIED 288 UNSPECIFIED DIMM RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD DUAL 18.9 mm 133.35 mm 3.9 mm MICRON TECHNOLOGY INC DIMM, compliant EAR99 8542.32.00.36 Micron 2017-09-20
IS49NLC96400A-33WBL
Integrated Silicon Solution Inc
$1.0000 Yes Active 603.9798 Mbit 9 64MX9 1.8 V MULTI BANK PAGE BURST DDR DRAM AUTO REFRESH 1 1 64000000 67.1089 M SYNCHRONOUS 1.9 V 1.7 V CMOS R-PBGA-B144 e1 260 10 144 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 18.5 mm 11 mm INTEGRATED SILICON SOLUTION INC TBGA, compliant EAR99 8542.32.00.32 Integrated Silicon Solution Inc.
IS46LQ16256A-062BLA2
Integrated Silicon Solution Inc
$1.0000 Yes Active 4.295 Gbit 16 256MX16 1.6 GHz MULTI BANK PAGE BURST LPDDR4 DRAM TERM PITCH-MAX; ALSO AVAILABLE WITH 1.7V TO 1.95V SUPPLY COMMON 1 1 256000000 268.4355 M SYNCHRONOUS NO 1.17 V 1.06 V CMOS INDUSTRIAL R-PBGA-B200 105 °C -40 °C 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 850 µm 14.5 mm 10 mm INTEGRATED SILICON SOLUTION INC FBGA-200 compliant EAR99 8542.32.00.36
IS43LQ16256AL-062BLI-TR
Integrated Silicon Solution Inc
$1.0000 Active DDR DRAM INTEGRATED SILICON SOLUTION INC unknown
IS45S16320D-7CTLA1
Integrated Silicon Solution Inc
$1.0000 End Of Life 536.8709 Mbit 16 32MX16 3.3 V 5.4 ns FOUR BANK PAGE BURST SYNCHRONOUS DRAM AUTO/SELF REFRESH 1 1 32000000 33.5544 M SYNCHRONOUS YES 3.6 V 3 V CMOS INDUSTRIAL R-PDSO-G54 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 54 PLASTIC/EPOXY TSOP2 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 800 µm DUAL 1.2 mm 22.22 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2, unknown EAR99 8542.32.00.28 Integrated Silicon Solution Inc. TSOP2 54
MTA9ADF1G72AZ-3G2E1
Micron Technology Inc
$1.0000 Obsolete 77.3094 Gbit 72 1GX72 1.2 V SINGLE BANK PAGE BURST DDR DRAM MODULE AUTO/SELF REFRESH; WD-MAX 1 1 1000000000 1.0737 G SYNCHRONOUS YES 1.26 V 1.14 V CMOS OTHER R-XDMA-N288 95 °C NOT SPECIFIED NOT SPECIFIED 288 UNSPECIFIED DIMM RECTANGULAR MICROELECTRONIC ASSEMBLY NO NO LEAD DUAL 18.9 mm 133.35 mm 2.7 mm MICRON TECHNOLOGY INC DIMM, compliant EAR99 8542.32.00.36 Micron 2017-11-10
IS46LQ16256A-062BLA1
Integrated Silicon Solution Inc
$1.0000 Yes Active 4.295 Gbit 16 256MX16 1.6 GHz MULTI BANK PAGE BURST LPDDR4 DRAM TERM PITCH-MAX; ALSO AVAILABLE WITH 1.7V TO 1.95V SUPPLY COMMON 1 1 256000000 268.4355 M SYNCHRONOUS NO 1.17 V 1.06 V CMOS INDUSTRIAL R-PBGA-B200 95 °C -40 °C 200 PLASTIC/EPOXY VFBGA BGA200,12X22,32/25 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 800 µm BOTTOM 850 µm 14.5 mm 10 mm INTEGRATED SILICON SOLUTION INC FBGA-200 compliant EAR99 8542.32.00.36 Integrated Silicon Solution Inc.
IS49NLC18320A-25WBL
Integrated Silicon Solution Inc
$1.0000 Yes Active 603.9798 Mbit 18 32MX18 1.8 V MULTI BANK PAGE BURST DDR DRAM AUTO REFRESH 1 1 32000000 33.5544 M SYNCHRONOUS 1.9 V 1.7 V CMOS R-PBGA-B144 e1 260 10 144 PLASTIC/EPOXY TBGA RECTANGULAR GRID ARRAY, THIN PROFILE YES TIN SILVER COPPER BALL 1 mm BOTTOM 1.2 mm 18.5 mm 11 mm INTEGRATED SILICON SOLUTION INC TBGA, compliant EAR99 8542.32.00.32
MT40A2G4SA-075:E
Micron Technology Inc
$1.0000 Obsolete 8.5899 Gbit 4 2GX4 1.2 V 1.333 GHz 8192 MULTI BANK PAGE BURST DDR4 DRAM COMMON 8 1 1 2000000000 2.1475 G SYNCHRONOUS YES 8 1.26 V 1.14 V CMOS OTHER R-PBGA-B78 e1 95 °C 260 30 78 PLASTIC/EPOXY TFBGA BGA78,9X13,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 11 mm 7.5 mm MICRON TECHNOLOGY INC TFBGA, compliant EAR99 8542.32.00.36 Micron 2017-07-13