Parametric results for: HM62W4100HLJP-15 under SRAMs

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IS66WV51216EALL-70BLI-TR
Integrated Silicon Solution Inc
$0.6944 Yes Active 8.3886 Mbit 16 512KX16 70 ns PSEUDO STATIC RAM 1 512000 524.288 k ASYNCHRONOUS PARALLEL 1.95 V 1.7 V CMOS INDUSTRIAL R-PBGA-B48 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS62WV2568BLL-55HLI-TR
Integrated Silicon Solution Inc
$0.6968 Yes Active 2.0972 Mbit 8 256KX8 55 ns STANDARD SRAM COMMON 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 10 µA 1 V 35 µA CMOS INDUSTRIAL R-PDSO-G32 Not Qualified 85 °C -40 °C 32 PLASTIC/EPOXY TSSOP TSSOP32,.56,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL INTEGRATED SILICON SOLUTION INC compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
23K640-I/ST
Microchip Technology Inc
$0.7204 Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC 4.40 MM, PLASTIC, TSSOP-8 compliant EAR99 8542.32.00.51 Microchip SOIC 8
IS62WV1288BLL-55HLI-TR
Integrated Silicon Solution Inc
$0.7558 Yes Yes Active 1.0486 Mbit 8 128KX8 3 V 55 ns STANDARD SRAM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e3 3 85 °C -40 °C 32 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.25 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1, compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc. TSOP1 32
IS62WV1288BLL-55TLI-TR
Integrated Silicon Solution Inc
$0.7558 Yes Yes Active 1.0486 Mbit 8 128KX8 3 V 55 ns STANDARD SRAM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e3 3 85 °C -40 °C 32 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1, compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc. TSOP1 32
23K640-I/P
Microchip Technology Inc
$0.7644 Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 compliant EAR99 8542.32.00.51 Microchip DIP 8
N25S830HAS22I
onsemi
$0.7715 Yes Active 262.144 kbit 8 32KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1, (3 LINE) 32000 32.768 k SYNCHRONOUS 3-STATE SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 30 8 PLASTIC/EPOXY SOP SOP8,.25 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.91 mm ONSEMI 0.150 INCH, GREEN, PLASTIC, SOIC-8 compliant EAR99 8542.32.00.41 onsemi SOIC-8 Narrow Body 8 751AZ
23A640-I/ST
Microchip Technology Inc
$0.7801 Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC 4.40 MM, PLASTIC, TSSOP-8 compliant EAR99 8542.32.00.51 Microchip SOIC 8
23K640-E/SN
Microchip Technology Inc
$0.8154 Yes Yes Active 65.536 kbit 8 8KX8 3 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 10 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS AUTOMOTIVE R-PDSO-G8 Not Qualified e3 3 125 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 compliant EAR99 8542.32.00.51 Microchip SOIC 8
CY7C199CN-15PXC
Cypress Semiconductor
$0.8160 Yes Yes Obsolete 262.144 kbit 8 32KX8 5 V 15 ns STANDARD SRAM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 500 µA 4.5 V 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e4 1 70 °C 260 40 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE NO NICKEL PALLADIUM GOLD THROUGH-HOLE 2.54 mm DUAL 4.82 mm 34.67 mm 7.62 mm CYPRESS SEMICONDUCTOR CORP 6.90 X 35.60 MM, 3.50 MM HEIGHT, LEAD FREE, PLASTIC, MO-095, DIP-28 compliant EAR99 8542.32.00.41 DIP 28