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IDT71342LA25JG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 32.768 kbit | 8 | 4KX8 | 5 V | 25 ns | MULTI-PORT SRAM | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | 1 | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 2 V | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J52 | Not Qualified | e3 | 70 °C | 52 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 4.57 mm | 19.1262 mm | 19.1262 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | QCCJ, | 52 | compliant | EAR99 | 8542.32.00.41 | ||||||||||||
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IDT71342LA25PF
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 25 ns | MULTI-PORT SRAM | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | COMMON | 1 | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 4 mA | 2 V | 240 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e0 | 3 | 70 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | PLASTIC, TQFP-64 | 64 | not_compliant | EAR99 | 8542.32.00.41 | |||||
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IDT71342S55LB
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 55 ns | MULTI-PORT SRAM | COMMON | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 230 µA | CMOS | MILITARY | S-XQCC-N52 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 52 | CERAMIC | QCCN | LCC52,.75SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||||||
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IDT71342LA20PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 32.768 kbit | 8 | 4KX8 | 5 V | 20 ns | MULTI-PORT SRAM | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | 1 | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 2 V | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G64 | Not Qualified | e3 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) | GULL WING | 800 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 64 | compliant | EAR99 | 8542.32.00.41 | 1995-01-01 | ||||||||
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IDT71342LA55J8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 55 ns | MULTI-PORT SRAM | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | COMMON | 1 | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 4 mA | 2 V | 200 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J52 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.57 mm | 19.1262 mm | 19.1262 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | PLASTIC, LCC-52 | 52 | not_compliant | EAR99 | 8542.32.00.41 | |||||
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IDT71342L45L52B
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 45 ns | MULTI-PORT SRAM | SEMAPHORE; AUTOMATIC POWER-DOWN | 1 | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 2 V | 5.5 V | 4.5 V | CMOS | MILITARY | S-CQCC-N52 | Not Qualified | 1 | 125 °C | -55 °C | 52 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 2.2098 mm | 19.05 mm | 19.05 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | LCC-52 | 52 | not_compliant | 3A001.A.2.C | 8542.32.00.41 | ||||||||||||
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IDT71342LA25J
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 25 ns | MULTI-PORT SRAM | SEMAPHORE; AUTOMATIC POWER-DOWN; BATTERY BACKUP | COMMON | 1 | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 4 mA | 2 V | 240 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J52 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 4.57 mm | 19.1262 mm | 19.1262 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | PLASTIC, LCC-52 | 52 | not_compliant | EAR99 | 8542.32.00.41 | |||||
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IDT71342L45L
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 45 ns | MULTI-PORT SRAM | COMMON | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.5 mA | 2 V | 200 µA | CMOS | COMMERCIAL | S-XQCC-N52 | Not Qualified | e0 | 70 °C | 52 | CERAMIC | QCCN | LCC52,.75SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 | |||||||||||||||||||
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IDT71342S35L52B
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 35 ns | MULTI-PORT SRAM | COMMON | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 300 µA | CMOS | MILITARY | S-XQCC-N52 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 52 | CERAMIC | QCCN | LCC52,.75SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | unknown | 3A001.A.2.C | 8542.32.00.41 | ||||||||||||||||||
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IDT71342SA55J
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 32.768 kbit | 8 | 4KX8 | 5 V | 55 ns | MULTI-PORT SRAM | SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 4000 | 4.096 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 240 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J52 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 52 | PLASTIC/EPOXY | QCCJ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.57 mm | 19.1262 mm | 19.1262 mm | INTEGRATED DEVICE TECHNOLOGY INC | LCC | PLASTIC, LCC-52 | 52 | not_compliant | EAR99 | 8542.32.00.41 |