Filter Your Search
1 - 4 of 4 results
|
K9F1208D0B-HCB00
Samsung Semiconductor
|
Check for Price | Yes | Yes | Obsolete | 536.8709 Mbit | 8 | 64MX8 | 2.65 V | 30 ns | FLASH | CONTAINS ADDITIONAL 16M BIT SPARE MEMORY | 1 | 64000000 | 67.1089 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 2.9 V | 2.4 V | CMOS | COMMERCIAL | R-PBGA-B63 | Not Qualified | e1 | 2 | 70 °C | 63 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 900 µm | 13 mm | 8.5 mm | SAMSUNG SEMICONDUCTOR INC | BGA | VFBGA, | 63 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||
|
K9F1208D0B-HCB0
Samsung Semiconductor
|
Check for Price | Yes | Obsolete | 536.8709 Mbit | 8 | 16K | 64MX8 | 2.65 V | 30 ns | FLASH | YES | NO | 4K | 64000000 | 67.1089 M | 512 words | PARALLEL | YES | 50 µA | 20 µA | CMOS | COMMERCIAL | NO | R-PBGA-B63 | Not Qualified | 70 °C | 63 | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA63,10X12,32 | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||||
|
K9F1208D0B-HIB0
Samsung Semiconductor
|
Check for Price | Yes | Obsolete | 536.8709 Mbit | 8 | 16K | 64MX8 | 2.65 V | 30 ns | FLASH | YES | NO | 4K | 64000000 | 67.1089 M | 512 words | PARALLEL | YES | 50 µA | 20 µA | CMOS | INDUSTRIAL | NO | R-PBGA-B63 | Not Qualified | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA63,10X12,32 | compliant | EAR99 | 8542.32.00.51 | |||||||||||||||||
|
K9F1208D0B-HIB00
Samsung Semiconductor
|
Check for Price | Yes | Yes | Obsolete | 536.8709 Mbit | 8 | 64MX8 | 2.65 V | 30 ns | FLASH | CONTAINS ADDITIONAL 16M BIT SPARE MEMORY | 1 | 64000000 | 67.1089 M | ASYNCHRONOUS | PARALLEL | 2.7 V | 2.9 V | 2.4 V | CMOS | INDUSTRIAL | R-PBGA-B63 | Not Qualified | e1 | 2 | 85 °C | -40 °C | 63 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 900 µm | 13 mm | 8.5 mm | SAMSUNG SEMICONDUCTOR INC | BGA | VFBGA, | 63 | compliant | EAR99 | 8542.32.00.51 |