Parametric results for: K9F1208D0B-H under Flash Memories

Filter Your Search

1 - 4 of 4 results

|
-
-
Manufacturer Part Number: k9f1208d0bh
Select parts from the table below to compare.
Compare
Compare
K9F1208D0B-HCB00
Samsung Semiconductor
Check for Price Yes Yes Obsolete 536.8709 Mbit 8 64MX8 2.65 V 30 ns FLASH CONTAINS ADDITIONAL 16M BIT SPARE MEMORY 1 64000000 67.1089 M ASYNCHRONOUS PARALLEL 2.7 V 2.9 V 2.4 V CMOS COMMERCIAL R-PBGA-B63 Not Qualified e1 2 70 °C 63 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 900 µm 13 mm 8.5 mm SAMSUNG SEMICONDUCTOR INC BGA VFBGA, 63 compliant EAR99 8542.32.00.51
K9F1208D0B-HCB0
Samsung Semiconductor
Check for Price Yes Obsolete 536.8709 Mbit 8 16K 64MX8 2.65 V 30 ns FLASH YES NO 4K 64000000 67.1089 M 512 words PARALLEL YES 50 µA 20 µA CMOS COMMERCIAL NO R-PBGA-B63 Not Qualified 70 °C 63 PLASTIC/EPOXY FBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA63,10X12,32 compliant EAR99 8542.32.00.51
K9F1208D0B-HIB0
Samsung Semiconductor
Check for Price Yes Obsolete 536.8709 Mbit 8 16K 64MX8 2.65 V 30 ns FLASH YES NO 4K 64000000 67.1089 M 512 words PARALLEL YES 50 µA 20 µA CMOS INDUSTRIAL NO R-PBGA-B63 Not Qualified 85 °C -40 °C 63 PLASTIC/EPOXY FBGA BGA63,10X12,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA63,10X12,32 compliant EAR99 8542.32.00.51
K9F1208D0B-HIB00
Samsung Semiconductor
Check for Price Yes Yes Obsolete 536.8709 Mbit 8 64MX8 2.65 V 30 ns FLASH CONTAINS ADDITIONAL 16M BIT SPARE MEMORY 1 64000000 67.1089 M ASYNCHRONOUS PARALLEL 2.7 V 2.9 V 2.4 V CMOS INDUSTRIAL R-PBGA-B63 Not Qualified e1 2 85 °C -40 °C 63 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 900 µm 13 mm 8.5 mm SAMSUNG SEMICONDUCTOR INC BGA VFBGA, 63 compliant EAR99 8542.32.00.51