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Manufacturer: AMD,AMD Xilinx
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XCF04SVOG20C
 AMD Xilinx 		$3.6534 Yes Yes Obsolete 4.1943 Mbit 8 512KX8 3.3 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 512000 524.288 k SYNCHRONOUS 3-STATE SERIAL 3.3 V 5 mA 10 µA 3.6 V 3 V CMOS NOR TYPE HARDWARE R-PDSO-G20 Not Qualified e3 3 85 °C -40 °C 260 30 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm TSSOP TSSOP-20 20 EAR99 8542.32.00.51
package
XCF08PFSG48C
 AMD Xilinx 		$8.2203 Yes Yes Obsolete 8.3886 Mbit 8 1MX8 1.8 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 1000000 1.0486 M SYNCHRONOUS 3-STATE SERIAL 1.8 V 1 mA 10 µA 2 V 1.65 V CMOS INDUSTRIAL NOR TYPE HARDWARE R-PBGA-B48 Not Qualified e2 3 85 °C -40 °C 260 30 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 800 µm BOTTOM 1.2 mm 9 mm 8 mm BGA TFBGA-48 48 EAR99 8542.32.00.51
package
XCF16PFSG48C
 AMD Xilinx 		$17.0646 Yes Yes Obsolete 16.7772 Mbit 8 2MX8 1.8 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 1.8 V 1 mA 10 µA 2 V 1.65 V CMOS INDUSTRIAL NOR TYPE HARDWARE R-PBGA-B48 Not Qualified e2 3 85 °C -40 °C 260 30 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 800 µm BOTTOM 1.2 mm 9 mm 8 mm BGA TFBGA-48 48 EAR99 8542.32.00.51
package
XCF16PFS48C
 AMD Xilinx 		$17.0646 No Obsolete 16.7772 Mbit 8 2MX8 1.8 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 2000000 2.0972 M SYNCHRONOUS 3-STATE SERIAL 1.8 V 1 mA 10 µA 2 V 1.65 V CMOS INDUSTRIAL NOR TYPE HARDWARE R-PBGA-B48 Not Qualified e0 3 85 °C -40 °C 240 30 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 8 mm BGA TFBGA-48 48 EAR99 8542.32.00.51
package
XCF32PVOG48C
 AMD Xilinx 		$27.7746 Yes Yes Obsolete 33.5544 Mbit 8 4MX8 1.8 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 4000000 4.1943 M SYNCHRONOUS 3-STATE SERIAL 1.8 V 1 mA 10 µA 2 V 1.65 V CMOS INDUSTRIAL NOR TYPE HARDWARE R-PDSO-G48 Not Qualified e3 3 85 °C -40 °C 260 30 48 PLASTIC/EPOXY TSSOP TSSOP48,.8,20 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 500 µm DUAL 1.2 mm 18.45 mm 12 mm TSOP TSOP-48 48 3A991.B.1.A 8542.32.00.51
package
XCF32PFSG48C
 AMD Xilinx 		$27.7746 Yes Yes Obsolete 33.5544 Mbit 8 4MX8 1.8 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 4000000 4.1943 M SYNCHRONOUS 3-STATE SERIAL 1.8 V 1 mA 10 µA 2 V 1.65 V CMOS INDUSTRIAL NOR TYPE HARDWARE R-PBGA-B48 Not Qualified e2 3 85 °C -40 °C 260 30 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) BALL 800 µm BOTTOM 1.2 mm 9 mm 8 mm BGA TFBGA-48 48 3A991.B.1.A 8542.32.00.51
package
XCF32PFS48C
 AMD Xilinx 		$27.7746 No Obsolete 33.5544 Mbit 8 4MX8 1.8 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 4000000 4.1943 M SYNCHRONOUS 3-STATE SERIAL 1.8 V 1 mA 10 µA 2 V 1.65 V CMOS INDUSTRIAL NOR TYPE HARDWARE R-PBGA-B48 Not Qualified e0 3 85 °C -40 °C 240 30 48 PLASTIC/EPOXY TFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN LEAD BALL 800 µm BOTTOM 1.2 mm 9 mm 8 mm BGA TFBGA-48 48 3A991.B.1.A 8542.32.00.51
package
XCF02SVOG20C
 AMD Xilinx 		$33.4880 Yes Yes Obsolete 2.0972 Mbit 8 256KX8 3.3 V 33 MHz CONFIGURATION MEMORY 20 20000 Write/Erase Cycles 1 256000 262.144 k SYNCHRONOUS 3-STATE SERIAL 3.3 V 5 mA 10 µA 3.6 V 3 V CMOS INDUSTRIAL NOR TYPE HARDWARE R-PDSO-G20 Not Qualified e3 3 85 °C -40 °C 260 30 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.19 mm 6.5024 mm 4.4 mm TSSOP TSSOP-20 20 EAR99 8542.32.00.51
package
XCF128XFTG64C
 AMD Xilinx 		$57.1200 Yes Obsolete 134.2177 Mbit 16 16K,64K 8MX16 1.8 V 85 ns FLASH ASYNCHRONOUS READ MODE YES YES NO 1 4,127 8000000 8.3886 M SYNCHRONOUS 4 words PARALLEL 1.8 V YES 75 µA 53 µA 2 V 1.7 V CMOS INDUSTRIAL NO NOR TYPE R-PBGA-B64 Not Qualified e1 3 85 °C -40 °C 260 30 64 PLASTIC/EPOXY TBGA BGA64,8X8,40 RECTANGULAR GRID ARRAY, THIN PROFILE YES Tin/Silver/Copper (Sn/Ag/Cu) BALL 1 mm BOTTOM 1.2 mm 13 mm 10 mm BGA 64 3A991.B.1.A 8542.32.00.51
AM29LV160BT-120UAC
 AMD 		Check for Price Obsolete 16.7772 Mbit 16 16K,8K,32K,64K 1MX16 120 ns FLASH 8 TOP YES YES YES 1,2,1,31 1000000 1.0486 M PARALLEL YES 5 µA 30 µA CMOS COMMERCIAL YES NOR TYPE R-PBGA-B45 Not Qualified e0 70 °C 45 PLASTIC/EPOXY FBGA BGA45,8X6,25 RECTANGULAR GRID ARRAY, FINE PITCH YES Tin/Lead (Sn/Pb) BALL 635 µm BOTTOM EAR99 8542.32.00.51
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