MCF5274LVM166 vs MCF5372LCVM240 feature comparison

MCF5274LVM166 NXP Semiconductors

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MCF5372LCVM240 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description ROHS COMPLIANT, MAPBGA-196 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 83 MHz 80 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e1 e1
Length 15 mm 15 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 196 196
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.75 mm
Speed 166 MHz 240 MHz
Supply Voltage-Max 1.6 V 1.6 V
Supply Voltage-Min 1.4 V 1.4 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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