93C56-E/P
vs
AM29LV160DT-90WCD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SPANSION INC
|
| Part Package Code |
DIP
|
BGA
|
| Package Description |
0.300 INCH, PLASTIC, DIP-8
|
TFBGA, BGA48,6X8,32
|
| Pin Count |
8
|
48
|
| Reach Compliance Code |
unknown
|
compliant
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS
|
TOP BOOT BLOCK
|
| Alternate Memory Width |
16
|
8
|
| Clock Frequency-Max (fCLK) |
2 MHz
|
|
| Data Retention Time-Min |
40
|
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PBGA-B48
|
| JESD-609 Code |
e0
|
e1
|
| Memory Density |
2048 bit
|
16777216 bit
|
| Memory IC Type |
EEPROM
|
FLASH
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
48
|
| Number of Words |
256 words
|
1048576 words
|
| Number of Words Code |
256
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256X8
|
1MX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TFBGA
|
| Package Equivalence Code |
DIP8,.3
|
BGA48,6X8,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Supplies |
5 V
|
3/3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Serial Bus Type |
MICROWIRE
|
|
| Standby Current-Max |
0.0001 A
|
0.000005 A
|
| Supply Current-Max |
0.004 mA
|
0.03 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
| Terminal Form |
THROUGH-HOLE
|
BALL
|
| Terminal Pitch |
2.54 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Write Cycle Time-Max (tWC) |
1 ms
|
|
| Write Protection |
SOFTWARE
|
|
| Base Number Matches |
2
|
2
|
| Access Time-Max |
|
90 ns
|
| Boot Block |
|
TOP
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| Length |
|
9 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
1,2,1,31
|
| Programming Voltage |
|
3 V
|
| Ready/Busy |
|
YES
|
| Seated Height-Max |
|
1.2 mm
|
| Sector Size |
|
16K,8K,32K,64K
|
| Toggle Bit |
|
YES
|
| Type |
|
NOR TYPE
|
| Width |
|
8 mm
|
|
|
|
Compare 93C56-E/P with alternatives
Compare AM29LV160DT-90WCD with alternatives