BR24G02FVT-3AGE2 vs AT24C02CU3-CUM-T feature comparison

BR24G02FVT-3AGE2 ROHM Semiconductor

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AT24C02CU3-CUM-T Microchip Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD MICROCHIP TECHNOLOGY INC
Package Description TSSOP, 2 X 1.50 MM, 0.50 MM PITCH, GREEN, VFBGA-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Factory Lead Time 11 Weeks
Samacsys Manufacturer ROHM Semiconductor
Additional Feature 1.7V AT 1MHZ 100 YEAR DATA RETENTION
Clock Frequency-Max (fCLK) 0.4 MHz 1 MHz
JESD-30 Code R-PDSO-G8 R-PBGA-B8
Length 4.4 mm 2 mm
Memory Density 2048 bit 2097152 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 262144 words
Number of Words Code 256 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm 0.85 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.6 V 1.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm 1.5 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 1
Source Content uid AT24C02CU3-CUM-T
Data Retention Time-Min 100
JESD-609 Code e3
Qualification Status Not Qualified
Terminal Finish MATTE TIN

Compare BR24G02FVT-3AGE2 with alternatives

Compare AT24C02CU3-CUM-T with alternatives