M25P32-VME6G vs W25Q80BLUXIP feature comparison

M25P32-VME6G Micron Technology Inc

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W25Q80BLUXIP Winbond Electronics Corp

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Part Package Code SOIC
Package Description HVSON, SOLCC8,.3 HVSON,
Pin Count 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Micron
Clock Frequency-Max (fCLK) 50 MHz 80 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-XDSO-N8 R-PDSO-N8
Length 8 mm 3 mm
Memory Density 33554432 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 4194304 words 1048576 words
Number of Words Code 4000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX8 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Equivalence Code SOLCC8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified
Seated Height-Max 1 mm 0.6 mm
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Width 6 mm 2 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 3 1
Output Characteristics 3-STATE

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