MT29F8G08ABACAH4:C vs MT29F8G08ABACAWP:C feature comparison

MT29F8G08ABACAH4:C Micron Technology Inc

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MT29F8G08ABACAWP:C Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description TFBGA, BGA63,10X12,32 TSSOP, TSSOP48,.8,20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Micron Micron
Command User Interface YES YES
Data Polling NO NO
JESD-30 Code R-PBGA-B63 R-PDSO-G48
Length 11 mm 18.4 mm
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Sectors/Size 4K 4K
Number of Terminals 63 48
Number of Words 1073741824 words 1073741824 words
Number of Words Code 1000000000 1000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1GX8 1GX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSSOP
Package Equivalence Code BGA63,10X12,32 TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size 4K words 4K words
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1 mm 1.2 mm
Sector Size 256K 256K
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Toggle Bit NO NO
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 12 mm
Base Number Matches 1 1

Compare MT29F8G08ABACAH4:C with alternatives

Compare MT29F8G08ABACAWP:C with alternatives