W29N08GVBJAF vs MT29F8G08ABACAH4:C feature comparison

W29N08GVBJAF Winbond Electronics Corp

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MT29F8G08ABACAH4:C Micron Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description VFBGA, TFBGA, BGA63,10X12,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond Micron
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 11 mm 11 mm
Memory Density 8589934592 bit 8589934592 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 1073741824 words 1073741824 words
Number of Words Code 1000000000 1000000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 105 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1GX8 1GX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3.3 V
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 9 mm
Base Number Matches 1 1
Rohs Code Yes
Command User Interface YES
Data Polling NO
Number of Sectors/Size 4K
Package Equivalence Code BGA63,10X12,32
Page Size 4K words
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 256K
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Toggle Bit NO

Compare W29N08GVBJAF with alternatives

Compare MT29F8G08ABACAH4:C with alternatives