W3E64M16S-266SBC
vs
MT47H64M16JN-25:H
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA60,9X12,40/32
|
TFBGA,
|
| Pin Count |
60
|
60
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.32
|
8542.32.00.32
|
| Access Mode |
FOUR BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
| Access Time-Max |
0.75 ns
|
0.4 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| Clock Frequency-Max (fCLK) |
133 MHz
|
|
| I/O Type |
COMMON
|
|
| Interleaved Burst Length |
2,4,8
|
|
| JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
| Length |
12.5 mm
|
10 mm
|
| Memory Density |
1073741824 bit
|
1073741824 bit
|
| Memory IC Type |
DDR1 DRAM
|
DDR2 DRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
60
|
60
|
| Number of Words |
67108864 words
|
67108864 words
|
| Number of Words Code |
64000000
|
64000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
64MX16
|
64MX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFBGA
|
| Package Equivalence Code |
BGA60,9X12,40/32
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
|
| Seated Height-Max |
2.56 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Sequential Burst Length |
2,4,8
|
|
| Standby Current-Max |
0.01 A
|
|
| Supply Current-Max |
0.8 mA
|
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 mm
|
8 mm
|
| Base Number Matches |
3
|
1
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD SILVER
|
|
|
|
Compare W3E64M16S-266SBC with alternatives
Compare MT47H64M16JN-25:H with alternatives