W3E64M16S-266SBC vs W3E64M16S-266NBI feature comparison

W3E64M16S-266SBC Microsemi Corporation

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W3E64M16S-266NBI White Electronic Designs Corp

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP WHITE ELECTRONIC DESIGNS CORP
Part Package Code BGA
Package Description BGA, BGA60,9X12,40/32 LBGA,
Pin Count 60
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.32
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.75 ns 0.75 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 12.5 mm 12.5 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type DDR1 DRAM DDR DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64MX16 64MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192
Seated Height-Max 2.56 mm 1.5 mm
Self Refresh YES YES
Sequential Burst Length 2,4,8
Standby Current-Max 0.01 A
Supply Current-Max 0.8 mA
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 10 mm
Base Number Matches 3 3

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