5962-3826701MXB
Xicor Inc
Description: EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32

Overview of 5962-3826701MXB by Xicor Inc

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Environmental Monitoring Industrial Automation Agriculture Technology Medical Imaging Electronic Manufacturing

Available Datasheets

Part # Manufacturer Description Datasheet
5962-8672601EA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16
5962-8672601FA Rochester Electronics LLC Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16
5962-87518013A Rochester Electronics LLC Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28

CAD Models for 5962-3826701MXB by Xicor Inc
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Part Data Attributes for 5962-3826701MXB by Xicor Inc

5962-3826701MXB
Xicor Inc
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
XICOR INC
Package Description
DIP,
Reach Compliance Code
unknown
Access Time-Max
250 ns
Additional Feature
AUTOMATIC WRITE; DATA RETENTION: 10 YEARS
Data Retention Time-Min
10
JESD-30 Code
R-GDIP-T32
JESD-609 Code
e0
Length
42.2 mm
Memory Density
1048576 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
5 V
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.72 mm
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Write Cycle Time-Max (tWC)
10 ms
Want to compare parts?
  1. 5962-3826701MXB
    Xicor Inc
    EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32
    VS

Alternate Parts for 5962-3826701MXB

This table gives cross-reference parts and alternative options found for 5962-3826701MXB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-3826701MXB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
PYX28C010-25CWMB EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Pyramid Semiconductor Corporation 5962-3826701MXB vs PYX28C010-25CWMB
X28C010DM-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 Xicor Inc 5962-3826701MXB vs X28C010DM-25
5962-3826701MXC EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32 Atmel Corporation 5962-3826701MXB vs 5962-3826701MXC
X28C010DMB-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, CERDIP-32 Xicor Inc 5962-3826701MXB vs X28C010DMB-25
X28C010PMB-25 EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32, PLASTIC, DIP-32 Xicor Inc 5962-3826701MXB vs X28C010PMB-25
5962-3826701MXX EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Teledyne e2v 5962-3826701MXB vs 5962-3826701MXX
AS28C010CW-25/IT EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERDIP-32 Micross Components 5962-3826701MXB vs AS28C010CW-25/IT
FT28C010-25CM-AT EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd 5962-3826701MXB vs FT28C010-25CM-AT
FT28C010-25CMB-X EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd 5962-3826701MXB vs FT28C010-25CMB-X
5962-3826701MXX EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32 LSI Corporation 5962-3826701MXB vs 5962-3826701MXX
Part Number Description Manufacturer Compare
5962-3826716QMX EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, CERAMIC, FP-32 Maxim Integrated Products 5962-3826701MXB vs 5962-3826716QMX
5962-3826701MXA EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 Atmel Corporation 5962-3826701MXB vs 5962-3826701MXA
5962-3826701MZB EEPROM, 128KX8, 250ns, Parallel, CMOS, FP-32 Xicor Inc 5962-3826701MXB vs 5962-3826701MZB
5962-3826701MUX EEPROM, 128KX8, 250ns, Parallel, CMOS, CQCC32 Microchip Technology Inc 5962-3826701MXB vs 5962-3826701MUX
5962-3826716QMC EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, DFP-32 Data Device Corporation 5962-3826701MXB vs 5962-3826716QMC
5962-3826701MUA EEPROM, 128KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation 5962-3826701MXB vs 5962-3826701MUA
5962-3826701MZX EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, BOTTOM BRAZED, CERAMIC, MO-115, FP-32 Teledyne e2v 5962-3826701MXB vs 5962-3826701MZX
5962-9679602HYA EEPROM, 128KX8, 250ns, Parallel, CMOS, CDIP32, CERAMIC, DIP-32 White Microelectronics 5962-3826701MXB vs 5962-9679602HYA
5962-3826716Q6C EEPROM, 128KX8, 250ns, Parallel, CMOS, FP-32 Maxwell Technologies 5962-3826701MXB vs 5962-3826716Q6C
5962-3826716QMC EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32, CERAMIC, DFP-32 Maxim Integrated Products 5962-3826701MXB vs 5962-3826716QMC

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