Part Details for 82S123B/BEA by NXP Semiconductors
Overview of 82S123B/BEA by NXP Semiconductors
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for 82S123B/BEA
82S123B/BEA CAD Models
82S123B/BEA Part Data Attributes
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82S123B/BEA
NXP Semiconductors
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Datasheet
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82S123B/BEA
NXP Semiconductors
IC 32 X 8 OTPROM, 30 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 30 ns | |
| JESD-30 Code | R-GDIP-T16 | |
| Length | 19.535 mm | |
| Memory Density | 256 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 32 words | |
| Number of Words Code | 32 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32X8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for 82S123B/BEA
This table gives cross-reference parts and alternative options found for 82S123B/BEA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 82S123B/BEA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M54731AS-1 | OTP ROM, 32X8, 30ns, Bipolar, CDIP16, METAL SEALED, CERAMIC, DIP-16 | Mitsubishi Electric | 82S123B/BEA vs M54731AS-1 |
| IDM29751NC | 32X8 OTPROM, 30ns, PDIP16, PLASTIC, DIP-16 | Texas Instruments | 82S123B/BEA vs IDM29751NC |
| 82S23B/BEA | IC 32 X 8 OTPROM, 30 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM | NXP Semiconductors | 82S123B/BEA vs 82S23B/BEA |
| IDM29750NC | 32X8 OTPROM, 30ns, PDIP16, PLASTIC, DIP-16 | Texas Instruments | 82S123B/BEA vs IDM29750NC |
| IDM29751JC | 32X8 OTPROM, 30ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | 82S123B/BEA vs IDM29751JC |
| IDM29750JC | 32X8 OTPROM, 30ns, CDIP16, HERMETIC SEALED, DIP-16 | Texas Instruments | 82S123B/BEA vs IDM29750JC |
| IDM29750NC | IC 32 X 8 OTPROM, 30 ns, PDIP16, PLASTIC, DIP-16, Programmable ROM | National Semiconductor Corporation | 82S123B/BEA vs IDM29750NC |