Part Details for AM27C256-175DI by AMD
Overview of AM27C256-175DI by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27C256-175DI
AM27C256-175DI CAD Models
AM27C256-175DI Part Data Attributes
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AM27C256-175DI
AMD
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Datasheet
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AM27C256-175DI
AMD
UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 170 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Length | 37.1475 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.588 mm | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-175DI
This table gives cross-reference parts and alternative options found for AM27C256-175DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-175DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| SMJ27C256-17J | 32KX8 UVPROM, 170ns, CDIP28, 0.600 INCH, SIDE BRAZED, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-175DI vs SMJ27C256-17J |
| AS27C256-17JXT | UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | AM27C256-175DI vs AS27C256-17JXT |
| AM27C256-175DC | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-175DI vs AM27C256-175DC |
| NMC27C256Q17 | IC 32K X 8 UVPROM, 170 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-175DI vs NMC27C256Q17 |
| NMC27C256Q17 | IC 32K X 8 UVPROM, 170 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | AM27C256-175DI vs NMC27C256Q17 |
| AT27C256R-17DI | UVPROM, 32KX8, 170ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | AM27C256-175DI vs AT27C256R-17DI |
| AM27256-1DEB | UVPROM, 32KX8, 170ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C256-175DI vs AM27256-1DEB |
| AM27C256-170DIB | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-175DI vs AM27C256-170DIB |
| AM27C256-175DCB | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-175DI vs AM27C256-175DCB |
| AM27C256-175DIB | UVPROM, 32KX8, 170ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-175DI vs AM27C256-175DIB |