Part Details for AM27X010-70JC by Spansion
Overview of AM27X010-70JC by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Part Details for AM27X010-70JC
AM27X010-70JC CAD Models
AM27X010-70JC Part Data Attributes
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AM27X010-70JC
Spansion
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Datasheet
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AM27X010-70JC
Spansion
OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | QFJ | |
Package Description | PLASTIC, LCC-32 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 55 ns | |
JESD-30 Code | R-PQCC-J32 | |
Length | 13.9 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HQCCJ | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.5 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.4 mm |
Alternate Parts for AM27X010-70JC
This table gives cross-reference parts and alternative options found for AM27X010-70JC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27X010-70JC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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IS27HC010-70PL | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Integrated Silicon Solution Inc | AM27X010-70JC vs IS27HC010-70PL |
CY27C010-70JCT | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | AM27X010-70JC vs CY27C010-70JCT |
AM27X010-70JI | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Spansion | AM27X010-70JC vs AM27X010-70JI |
CY27C010-70JC | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | AM27X010-70JC vs CY27C010-70JC |
CY27C010-70JIR | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | AM27X010-70JC vs CY27C010-70JIR |
NM27C010V70X | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Fairchild Semiconductor Corporation | AM27X010-70JC vs NM27C010V70X |
CY27H010-70JCT | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | AM27X010-70JC vs CY27H010-70JCT |
CY27H010-70JC | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Cypress Semiconductor | AM27X010-70JC vs CY27H010-70JC |
AT27BV010-70JIT/R | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Atmel Corporation | AM27X010-70JC vs AT27BV010-70JIT/R |
AT27C010-70JJ | OTP ROM, 128KX8, 70ns, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 | Atmel Corporation | AM27X010-70JC vs AT27C010-70JJ |