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4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 8 |
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M2732AF1
STMicroelectronics
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M2732AF1
STMicroelectronics
4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | |
Pin Count | 24 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Samacsys Manufacturer | STMicroelectronics | |
Access Time-Max | 250 ns | |
Additional Feature | 21V PROGRAMMING VOLTAGE | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 31.75 mm | |
Memory Density | 32768 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 21 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.715 mm | |
Supply Current-Max | 0.125 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
This table gives cross-reference parts and alternative options found for M2732AF1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2732AF1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
TD2732A | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | M2732AF1 vs TD2732A |
8001203JX | UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | Intel Corporation | M2732AF1 vs 8001203JX |
LD2732A | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | M2732AF1 vs LD2732A |
TMS2732A-25JP4 | 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | Texas Instruments | M2732AF1 vs TMS2732A-25JP4 |
AM2732B-250/BJA | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | M2732AF1 vs AM2732B-250/BJA |
8001209JX | UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | AMD | M2732AF1 vs 8001209JX |
LD2732A-25 | UVPROM, 4KX8, 250ns, HMOS, CDIP24, CERAMIC, DIP-24 | Intel Corporation | M2732AF1 vs LD2732A-25 |
AM2732BDI | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | M2732AF1 vs AM2732BDI |
AM2732BDC | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | M2732AF1 vs AM2732BDC |
AM2732B-250DI | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | M2732AF1 vs AM2732B-250DI |