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EEPROM Card, 16MX16, 100ns, Parallel, CMOS, PBGA64, FBGA-64
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-S29GL256S10FHI020-ND
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DigiKey | IC FLASH 256MBIT PARALLEL 64FBGA Min Qty: 900 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
|
$5.8066 | Buy Now |
DISTI #
S29GL256S10FHI020
|
Avnet Americas | NOR Flash Parallel 3V/3.3V 256Mbit 16M x 16bit 100ns 64-Pin FBGA Tray - Trays (Alt: S29GL256S10FHI020) RoHS: Compliant Min Qty: 900 Package Multiple: 180 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$5.5461 | Buy Now |
DISTI #
727-S29GL256S10FHI02
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Mouser Electronics | NOR Flash U RoHS: Compliant | 0 |
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$5.6100 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 900 Package Multiple: 900 Lead time: 8 Weeks | 0 |
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$4.9900 | Buy Now |
DISTI #
SP005636781
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EBV Elektronik | (Alt: SP005636781) RoHS: Compliant Min Qty: 900 Package Multiple: 900 Lead time: 9 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
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S29GL256S10FHI020
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
S29GL256S10FHI020
Infineon Technologies AG
EEPROM Card, 16MX16, 100ns, Parallel, CMOS, PBGA64, FBGA-64
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | FBGA-64 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.1.B.1 | |
HTS Code | 8542.32.00.51 | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Infineon | |
Access Time-Max | 100 ns | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | YES | |
Data Retention Time-Min | 20 | |
Endurance | 100000 Write/Erase Cycles | |
JESD-30 Code | R-PBGA-B64 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Memory Density | 268435456 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Sectors/Size | 256 | |
Number of Terminals | 64 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA64,8X8,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Page Size | 16 words | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3 V | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Seated Height-Max | 1.4 mm | |
Sector Size | 64K | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.1 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Toggle Bit | YES | |
Type | NOR TYPE | |
Width | 11 mm |
This table gives cross-reference parts and alternative options found for S29GL256S10FHI020. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S29GL256S10FHI020, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
S29GL256S10DHIV10 | Flash, 32MX8, 100ns, PBGA64, | Infineon Technologies AG | S29GL256S10FHI020 vs S29GL256S10DHIV10 |
S29GL256S10DHIV13 | Flash, 32MX8, 100ns, PBGA64, LEAD FREE, PACKAGE | Spansion | S29GL256S10FHI020 vs S29GL256S10DHIV13 |
S29GL256S10FHIV20 | Flash, 32MX8, 100ns, PBGA64, | Infineon Technologies AG | S29GL256S10FHI020 vs S29GL256S10FHIV20 |
S29GL256S10FAIV13 | Flash, | Cypress Semiconductor | S29GL256S10FHI020 vs S29GL256S10FAIV13 |
S29GL256S10FHAV13 | Flash, 32MX8, 100ns, PBGA64, FBGA-64 | Cypress Semiconductor | S29GL256S10FHI020 vs S29GL256S10FHAV13 |
S29GL256S10DHI023 | Flash, 32MX8, 100ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 | Spansion | S29GL256S10FHI020 vs S29GL256S10DHI023 |
S29GL256S10DHI013 | Flash, 32MX8, 100ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 | Cypress Semiconductor | S29GL256S10FHI020 vs S29GL256S10DHI013 |
S29GL256S10DHI010 | Flash, 32MX8, 100ns, PBGA64, 9 X 9 MM, HALOGEN FREE AND LEAD FREE, FBGA-64 | Cypress Semiconductor | S29GL256S10FHI020 vs S29GL256S10DHI010 |
S29GL256S10FHIV10 | Flash, 32MX8, 100ns, PBGA64, | Infineon Technologies AG | S29GL256S10FHI020 vs S29GL256S10FHIV10 |
S29GL256S10DHIV23 | Flash, 32MX8, 100ns, PBGA64, PACKAGE | Cypress Semiconductor | S29GL256S10FHI020 vs S29GL256S10DHIV23 |