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31 - 40 of 45,130 results
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COM2601
SMSC
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Check for Price | No | Obsolete | MOS | COMMERCIAL | R-XDIP-T40 | e0 | Not Qualified | 70 °C | 235 | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | STANDARD MICROSYSTEMS CORP | DIP-40 | unknown | 8542.39.00.01 | ||||||||||||||
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UPD77533S1-YHC
NEC Electronics Group
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Check for Price | No | Obsolete | 1.5 V | MOS | TELECOM CIRCUIT | 1 | OTHER | S-PBGA-B108 | e0 | Not Qualified | 85 °C | -20 °C | 108 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 11 mm | 11 mm | 1.66 mm | NEC ELECTRONICS CORP | 11 X 11 MM, PLASTIC, FBGA-108 | compliant | 8542.39.00.01 | BGA | 108 | |||||||
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PT1482B
Western Digital Corp
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Check for Price | No | Obsolete | MOS | COMMERCIAL | R-PDIP-T40 | e0 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WESTERN DIGITAL CORP | DIP, DIP40,.6 | unknown | 8542.39.00.01 | |||||||||||||||
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MX346P
Mx Com Inc
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Check for Price | No | Obsolete | 5 V | MOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDIP-T24 | e0 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 31.622 mm | 5.753 mm | MX COM INC | DIP, DIP24,.6 | unknown | 8542.39.00.01 | ||||||||
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M088F1
STMicroelectronics
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Check for Price | No | Obsolete | 5 V | MOS | 180 mA | COMMERCIAL | R-XDIP-T40 | e0 | Not Qualified | 70 °C | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | STMICROELECTRONICS | DIP, DIP40,.6 | not_compliant | 8542.39.00.01 | |||||||||||||
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COM2601P
Microchip Technology Inc
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Check for Price | No | Active | MOS | COMMERCIAL | R-PDIP-T40 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | MICROCHIP TECHNOLOGY INC | DIP-40 | unknown | 8542.39.00.01 | |||||||||||||||||
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ML927
Dynex Semiconductor
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Check for Price | No | Obsolete | MOS | TELECOM CIRCUIT | COMMERCIAL | R-PDIP-T8 | e0 | Not Qualified | 65 °C | -10 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | GEC PLESSEY SEMICONDUCTORS | DIP, DIP8,.3 | unknown | 8542.39.00.01 | |||||||||||||
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PT1482B-01
Western Digital Corp
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Check for Price | No | Obsolete | MOS | COMMERCIAL | R-PDIP-T40 | e0 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | WESTERN DIGITAL CORP | DIP, DIP40,.6 | unknown | 8542.39.00.01 | |||||||||||||||
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UPD77533S1-YHC
Renesas Electronics Corporation
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Check for Price | Obsolete | 1.5 V | MOS | TELECOM CIRCUIT | 1 | OTHER | S-PBGA-B108 | Not Qualified | 85 °C | -20 °C | 108 | PLASTIC/EPOXY | LFBGA | BGA108,12X12,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 11 mm | 11 mm | 1.66 mm | RENESAS ELECTRONICS CORP | LFBGA, BGA108,12X12,32 | unknown | 8542.39.00.01 | BGA | 108 | |||||||||
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M5912F1
SGS-Ates Componenti Electronici SPA
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Check for Price | No | Obsolete | 5 V | MOS | T-1(DS1) | -5 V | COMMERCIAL | R-XDIP-T16 | e0 | Not Qualified | 70 °C | 16 | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | SGS-ATES COMPONENTI ELECTRONICI S P A | DIP, DIP16,.3 | unknown | 8542.39.00.01 |